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Most ASIC projects do not fail because the idea was bad.
They fail because risk was misunderstood, hidden, or postponed. By the time problems become visible, the project is already expensive, politically difficult to stop, and painful to fix.
The uncomfortable truth is that most ASIC failures are
Choosing an ASIC node is one of the easiest ways to add cost and risk without realizing it.
Many teams assume that the most advanced node automatically delivers the best product. In practice, experienced teams do the opposite: they choose the least aggressive node that still meets the product
Many first-time ASIC conversations fail before they begin.
Not because the idea is wrong, but because expectations are misaligned. Teams approach vendors too early with vague goals, or too late after internal assumptions have already hardened into unrealistic plans.
The result is frustration on both sides: slow quotes,
The question most teams ask is simple:
“At what volume does ASIC become cheaper than FPGA?”
The problem is that the question is usually asked too late, and answered too simplistically. There is no single magic number where ASIC suddenly becomes the obvious choice. The real break-even point
Most ASIC schedules fail quietly.
Not because of one catastrophic mistake, but because they were planned as if silicon behaved like software: linear progress, easy reversals, and unlimited iteration. In reality, ASIC development is constrained by physics, manufacturing, and verification effort. Late changes are expensive, and uncertainty compounds quickly.
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For many teams, the term “ASIC NRE” is enough to stop the conversation.
It sounds like a single, large, opaque number that appears late in the process and instantly kills the business case. In reality, NRE is not one thing, and it is rarely as arbitrary as it feels.
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Most teams don’t decide to move from FPGA to ASIC.
They get pushed there.
At the beginning of a product’s life, FPGA feels like freedom: fast iteration, low upfront cost, and a clear path to demos and early customers. But once a product starts shipping, the rules change.
Focused Ion Beam (FIB) technology is one of the most versatile tools used in semiconductor failure analysis and microelectronics characterization. A FIB system directs a tightly focused beam of ions onto a sample. By controlling the beam current, energy, position and scanning pattern, engineers can remove material from extremely specific locations,
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The Human Body Model (HBM) Electrostatic Discharge (ESD) test is the oldest and most widely used ESD test in the electronics industry. The JEDEC HBM test isn’t static; it has been revised to keep up with the rapid changes in the semiconductor industry. The latest revision of the spec addresses failures
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Dec. 09, 2025 – The Startup-Nation is increasingly demanding highly efficient, customized classical and post-quantum cryptography. This partnership brings high-assurance system-tailored security to Israel; a “Crypto-Security Boutique.”
Jerusalem, Israel – December 9, 2025 – FortifyIQ, Inc., a provider of high-assurance hardware and software security solutions and services, announced today the signing