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Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc. (QTI), and Samsung Electronics Co., Ltd., have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies’ latest Snapdragon premium processor, Qualcomm® Snapdragon™ 835, with Samsung’s 10-nanometer (nm) FinFET process technology.
The decision to use Samsung’s cutting
The semiconductor IP core market has grown dramatically in the last 10 years. There are literally hundreds of IP core suppliers in the market providing almost every possible functionally – from DC/DC and PLLs to Bluetooth and CPU cores. This large number of vendors and IP cores makes the selection
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The forecasted top-20 worldwide semiconductor (IC and O S D—optoelectronic, sensor, and discrete) sales ranking for 2016 is shown in Figure 1. It includes eight suppliers headquartered in the U.S., three in Japan, three in Taiwan, three in Europe, two in South Korea, and one in Singapore, a relatively broad
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Siemens is further building its Vision 2020 to shape Digital Industrial Enterprise by expanding its unique portfolio for industrial software. Siemens and Mentor Graphics (NASDAQ: MENT) (“Mentor”) today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for $37.25 per share in cash, which
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In our connected and mobile world, IC designers are striving to save µA or even nA of power consumption to extend battery usage without recharge. IoT applications bring the need for LP to new heights involving the adoption of more complex SoC architectures based on multiple power domains, which also
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First off, we need to define what is meant by “quality” for this discussion. In generic terms it means something like “how well a product does its job”. For a chip, or a rather what comes out the end of a chip supply chain, this isn’t simply a measure of
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IC Package Price calculator is an online IC package price estimation tool that covers all the major IC package types exist today.
To use the IC package price tool simply select the IC package type, number of pins and volume and the tool will send you an email with
Datacenters with few other emerging applications will become a multibillion dollar market for silicon photonics by 2025. Transporting high level of data with existing technologies will soon reach its limit and photons will continue replacing step by step electrons throughout networks. Growing investments made by VCs have been identified by
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Bengaluru (India) – Oct 25th, 2016 –SilabTech, a leading supplier of high speed serial interface intellectual property designs (IP cores) announced today the release of its High Speed Serial Trace Port (HSSTP) PHY. This IP Core is silicon proven on TSMC 28HPC and was successfully delivered to a Tier-1 global
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SINGAPORE and SAN JOSE, Calif., Nov. 02, 2016 (GLOBE NEWSWIRE) — Broadcom Limited (Nasdaq:AVGO) and Brocade Communications Systems, Inc. (Nasdaq:BRCD) today announced that they have entered into a definitive agreement under which Broadcom will acquire Brocade, a leader in Fibre Channel storage area network (“FC SAN”) switching and IP networking, for $12.75
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