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Tokyo, Japan – October 2, 2024 – Toppan Photomask, a global leader in the semiconductor photomask industry, will officially change its name to Tekscend Photomask on November 1, 2024. The rebranding represents a strategic move to reflect the company’s ongoing commitment to technological innovation and growth as a premier photomask
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Beijing, China – October 2, 2024 – China’s integrated circuit (IC) exports have experienced a remarkable recovery in 2024, showing strong growth despite recent global downturns in the semiconductor industry. According to customs data reported by People’s Daily, IC exports from China in the first eight months of 2024 reached
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MILPITAS, Calif. — September 26, 2024 — Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2027 report. The robust spending is being driven by the regionalization of semiconductor fabs and
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According to a recent report by Money DJ, Japan’s semiconductor manufacturing equipment sales have experienced remarkable growth, with August sales soaring by 20%. This marks the fifth consecutive month of double-digit growth and positions the sales figures as the fifth-highest on record. Notably, sales for the January-August period have reached
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Sep. 19, 2024 —- TrendForce posits that the wafer foundry market is expected to see a recovery in 2025, with an estimated annual growth of 20%—up from 16% in 2024. This positive outlook comes despite the weak end-market demand for consumer products, which has led component manufacturers to adopt a conservative
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September 18, 2024 – China’s semiconductor industry is experiencing a resurgence, emerging from a downturn and entering a phase of gradual recovery. Driven by increasing downstream demand, more than 30 semiconductor-related projects are accelerating across various stages, from contract signing to construction, topping-out, and production.
These projects span a wide
In a significant achievement for the automotive industry, Cadence’s Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® Semiconductors’ latest automotive audio DSP family, enabling advanced audio capabilities for next-generation software-defined vehicles. This development addresses the growing need for sophisticated audio processing to support traditional DSP tasks
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Today Arm is announcing some significant new developments in our mission to make the developer experience as frictionless as possible, wherever they are in the ML stack. We’re working closely with leading cloud providers and frameworks to create an environment that makes it easy for software developers to bring accelerated
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BLOOMINGTON, Minn. – September, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO John Sakamoto, Haddad will build and scale SkyWater’s advanced packaging business serving both the defense
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Saxony, Germany, a leading European semiconductor hub, is deepening its ties with Taiwan, as TSMC expands its European footprint. This strategic partnership, fueled by over EUR50 billion in industry investments, aims to position Saxony as a global semiconductor powerhouse, centered in Dresden’s “Silicon Saxony.”
Beyond chips, the collaboration extends