Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
According to Yole Group, in the Advanced Packaging Market Monitor Q2 2024, advanced packaging revenue reached US$10.2 billion in Q1 2024. This quarter is anticipated to be the weakest of the year, with an 8.1% revenue decline from the previous quarter due to the seasonality that typically impacts the back-end business
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its MIPI D-PHY and V-by-One (VBO) PHY IP portfolios now support processes that range from 55nm to 22nm on UMC platform. Faraday has shipped over 100 million video interface IP solutions for AIoT, industrial,
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Avnet ASIC, a division of Avnet Silica, an Avnet company (NASDAQ: AVT), today announced that it has launched its new ultra-low-power design services for TSMC’s cutting-edge 4nm and below process technologies. These services are designed to enable customers to achieve exceptional power efficiency and performance in their high-performance applications, such as blockchain
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NOIDA, India, May 27, 2024—HCLTech, a leading global technology company, and Arm, a leading technology provider of processor IP, announced their collaboration to augment custom silicon chips that support AI-driven business operations.
The partnership will bring to market solutions that enable semiconductor manufacturers, system OEMs and cloud services providers to enhance the
Place and route is an important part of the ASIC design flow and act as both mapmaker and builder within the silicon landscape, determining where components reside and how they connect while meeting stringent technical requirements. Its role is pivotal; without effective practices here, the most innovative chip designs could
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Jul. 3, 2024 —- In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.
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Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicle. This participation in the alliance underscores
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HBM presents a significant leap over traditional memory types. Key features such as astonishing memory bandwidth, reduced power consumption, impressive memory capacity, and swift transfer rates distinguish HBM from its predecessors. Understanding these characteristics is essential for appreciating the impact of this cutting-edge technology.
Embark on a
[Newton, Massachusetts, June 26, 2024] – FortifyIQ, a leading provider of advanced security semiconductor solutions, announces the release of FortiPKA-RISC-V, a revolutionary public key accelerator, with enhanced performance and area, designed to meet the demanding requirements of modern asymmetric cryptography algorithms. The PKA streamlines complex processes such as encryption/decryption, and
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At the heart of ReRAM is a simple, yet profound concept: resistive switching. This mechanism, involving filament formation and the influence of an electric field, is what sets ReRAM apart in the realm of modern memory solutions. Understanding these principles is crucial to appreciate the full potential of ReRAM.
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