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Migdal HaEmek, Israel – January 4th, 2022 – ATS Engineering, a leading Israeli test house, and Panther Technology, a leading OSAT (Outsourcing Assembly and Test) for HVM (High Volume Manufacturing) announced a new collaboration for supporting customers with Testing at the HVM (High Volume Manufacturing) stage.
Under this collaboration,
IC Insights is updating its comprehensive forecasts and analyses of the IC industry for its 25th edition of The McClean Report, which will be released in January 2022. Throughout next year, the report will include updated quarterly rankings of the worldwide top-25 semiconductor suppliers.
The 17 companies forecast to have
BLOOMINGTON, Minn. – November 15, 2021 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the appointment of two new members to its board of directors: Nancy Fares and Amy Leong, effective January 3, 2022 for a term expiring at the company’s 2022 Annual Meeting of Stockholders. These appointments
Read MoreHSINCHU, Taiwan, R.O.C., Dec. 16, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products. N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family. The “X”
Read MoreBecause Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing and test process. It says that it has noticed increased lead times for SOC package design and manufacturing, particularly for flip
Read MoreOXFORD, United Kingdom – December 10th, 2021 – EnSilica, a leading provider of mixed-signal custom application-specific integrated circuits (ASICs) for the automotive, satellite communications and healthcare industries, today announced that it has been selected by AST SpaceMobile, Inc. (NASDAQ: ASTS) to develop the next generation ASIC for use in the company’s planned space-based
Read MoreReading, UK 7 December 2021. Sondrel has revealed that its recently launched family of Architecting the future™ IP platforms are very easy to modify to precisely match customers’ ASIC requirements. This is because of its innovative Scalable Architecture Framework™ (SAF) that they are all based on. This uses re-usable, modular
Read MoreIC Insights proudly celebrates its 25th anniversary by offering the 2022 edition of The McClean Report service. The McClean Report service begins with the Semiconductor Industry Flash Report, which will be released in January of next year, and will provide clients with IC Insights’ initial overview and annual forecast of the semiconductor industry for the upcoming
Read MoreMont-Saint-Guibert, Belgium, November 29, 2021 – Not yet officially announced but not exactly a secret either; intoPIX, leading expert in video compression for ProAV, has again extended its large range of JPEG XS codecs with the addition of the Flawless Imaging Profile (FIP) in its revolutionary “TicoXS FIP” Codec.
It has been our pleasure to interview Sureshbabu K, MD of Caliber Interconnect Solutions. In this engaging conversation, he shares Caliber’s journey so far and what lies ahead for his company as it has emerged stronger in the post pandemic world and poised to grow significantly in the years to
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