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What quality of on-board devices and components do you think are chosen for space missions? The answer is of course devices and components built to survive the most intense environmental factors presented in space.
To support our partners and industry colleagues, we’ve developed this blog to highlight the most important
Mauguio, France – June, 14th 2021: Cortus S.A.S., a leader in custom Systems-on-Chip (SoC) design services and integrated circuit (IC) provider, today announced that it is developing the high-performance Out-of-Order (OoO) processor core which is at the heart of the European eProcessor project. This project is lead by the Barcelona
Read MoreIn this month’s June Update to The McClean Report, IC Insights will present its forecast for IC usage by major product type and end-use application (i.e., computer, communications, consumer, automotive, industrial, and government/military) through 2025.
Figure 1 shows that since 1998, only the automotive and communications end-use segments have gained marketshare.
ICsense, a TDK Group Company and independent subsidiary that focuses on ASIC supply and custom IC design services, is scaling up its bench test facilities by 40% and installing in-house ATE (Automated Test Equipment) facilities to uniquely offer its customers in the automotive, medical, industrial and consumer sectors a true
Read MoreMeylan, FRANCE – June 08, 2021 – In wake of the recently announced partnership with Tiempo Secure for silicon implementation of CC (Common Criteria) EAL5+ grade Secure Element IP, IC’Alps has deployed an infrastructure that complies with the highest security standards.
IC’Alps is a French semiconductor company specializing in
In June 2021, Google replaced millions of Intel’s CPU with home grown chips. This article provides and overview of the new ASIC developed by team Google to help optimizing the performance of YouTube servers. A custom-made ASIC (chip) rather than a general purpose ASIC (CPU), is design specifically by Google
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Figure 1 – OSAT Offering by Application and by Types of Packaging
What is OSAT?
OSAT stands for Outsourced Semiconductor Assembly and Test. This is a third-party service that suppliers around the world offer, which consists, as the name implies, of semiconductor assembly, packaging and testing of
Austin, TX.– June 1, 2021—Criteria Labs, an industry leader in high performance RF space components and semiconductor engineering solutions has partnered with Manufacturer’s Representatives to meet the needs of its growing customer base. The firms will support Criteria Labs’ space qualified device, eutectic die attachment, die to shim attachment, chip
Read MoreIC Insights released its May Update to the 2021 McClean Report last week. This Update included a discussion of the 1Q21 IC industry market results, an updated quarterly forecast for the remainder of this year, and a look at the top-25 1Q21 semiconductor suppliers. The top-15 1Q21 semiconductor suppliers are covered in this research bulletin.
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Woodcliff Lake, New Jersey — May 24, 2021 — Semiconductor intellectual property provider CAST, Inc. today announced the immediate availability of EMSA5-FS, a fault-tolerant embedded RISC-V processor IP core designed to meet the most stringent functional safety requirements of automotive, airborne, and other safety-critical applications.
Developed by Fraunhofer IPMS,