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AnySilicon, the leading marketplace for ASIC service providers, announced today that IC’Alps, a fabless semiconductor company developing state-of-the-art fully custom Integrated Circuits (IC) combined with a complete management of the supply chain, has joined AnySilicon to promote its design & supply services. As part of the AnySilicon platform, IC’Alps will
Read MorePower semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is
Read MoreIC Insights will soon release its Mid-Year Update to The McClean Report that includes its most current forecast for the global IC market from 2021 through 2025. In a very rare event, 32 of the 33 major IC market categories defined by WSTS are forecast to enjoy an increase in sales this year, with
Read Morearaday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its LPDDR4 and LPDDR4X combo PHY IP up to 4.2Gbps is now available in Samsung’s 14nm LPC process. The silicon proven solution provides smaller area, lower power, and high bandwidth for applications such as multi-media,
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Figure 1: General Overview of the Semiconductor Supply Chain
Being one of the most complex supply chains in the world, the semiconductor supply chain is worth around $0.5 trillion and is often very difficult to understand and manipulate. But before we dive deeper, we need to know what
Figure 1: GlobalFoundries Fab1 in Dresden Germany
What is a Semiconductor Foundry?
In simple terms, a semiconductor foundry (also known as a fab) is a factory where silicon wafers are manufactured. The main customers of a semiconductor foundry are chip makers such as: Broadcom, Qualcomm, Intel, AMD and
Meyreuil, France and San Jose, Calif., June 24, 2021—Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto is
Read MoreSeoul, South Korea – June 17th, 2021 – Chips&Media, a worldwide leading hardware IP provider of video codec, computer vision, and image signal processing, today unveiled AV1 supported video encoder hardware IP WAVE627, from the newly released next-generation video codec IP platform, WAVE6.
The WAVE6 series is a newly designed
What quality of on-board devices and components do you think are chosen for space missions? The answer is of course devices and components built to survive the most intense environmental factors presented in space.
To support our partners and industry colleagues, we’ve developed this blog to highlight the most important
Mauguio, France – June, 14th 2021: Cortus S.A.S., a leader in custom Systems-on-Chip (SoC) design services and integrated circuit (IC) provider, today announced that it is developing the high-performance Out-of-Order (OoO) processor core which is at the heart of the European eProcessor project. This project is lead by the Barcelona
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