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Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.
HPC is highly intensive in terms of CPU activity and requires ever increasing levels of
SAN JOSE, CA — Efabless, a crowd-sourcing design platform for custom silicon, today announced the launch of the Chiplicity Design Partner Program. The program supports ASIC and IP design partners across multiple services provided by the Efabless platform in responding to requests and developing custom ICs for product OEM or
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“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.
Under this dynamic context, the market research
Automotive electronics testing is one of the most exacting of all test and qualification protocols before production release because of the safety and liability considerations. The AEC Q100 revisions, ZVEI and its French equivalent SIA for accelerated environment stress tests not only list the time or number of cycles that
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Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today announced ARM Empowered Design, a suite for ARM based concept to product realization services with special emphasis on IoT and intelligent edge solutions. ARM Empowered Design offers customized engagement models that complement customer
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Sales of automotive electronic systems are forecast to increase 7.0% in 2018 and 6.3% in 2019, the highest growth rate in both years among the six major end-use applications for semiconductors. Figure 1 shows that sales of automotive-related electronic systems are forecast to increase to $152 billion in 2018 from
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Andes Technology Corporation, a leading supplier of small, low-power, high performance 32-/64-bit embedded CPU cores, and INVECAS, a provider of leading edge IP solutions, design services and turn-key ASIC capabilities today announced a partnership. The aim of the collaboration is to win RISC-V-based SoC designs for advanced Fab processes. Andes
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The TOLL package is a highly efficient space-saving package featuring extremely low Rds(on) and strong thermal performance making it well suited for high current and high voltage applications. It meets an existing JEDEC package outline, is 30% smaller and 50% thinner than a DDPAK package. The TOLL package leads are designed with wettable flanks
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IC Insights’ November Update to the 2018 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2018 (the top-15 2018 semiconductor suppliers are covered in this research bulletin). The Update also includes a detailed five-year forecast of the IC market by product type (including dollar volume, unit shipments,
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Since the development of the first ASIC, the IC package was a mean to protect the silicon die and to provide means to PCB connectivity. Back then, the IC package was large and introduced various electrical parasitic.
WLCSP package is one of the latest and most impressive invention of