Find ASIC Vendors

RDL

Redistribution Layer is a metal later used to connect the die’s pads to the die’s bumps.

Recent Stories

Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

ICsense achieves 14% revenue growth and EBITDA nearing 2 MEuro

ICsense achieves 14% revenue growth and EBITDA nearing 2 MEuro

The Ultimate Signoff (TapeOut) Checklist

The Ultimate Signoff (TapeOut) Checklist

The Ultimate Guide to RFICs

The Ultimate Guide to RFICs

Chips&Media Announces the Release of “CMNP,” the New Neural Processor IP

Chips&Media Announces the Release of “CMNP,” the New Neural Processor IP

Ashling’s RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST

Ashling’s RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST

The Ultimate Guide to Semiconductor Packaging

The Ultimate Guide to Semiconductor Packaging

Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.

Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.