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Dolphin Integration Appoints Christian Dupont As CEO

February 19, 2018, anysilicon

dolphin

Dolphin Integration enters a new era following the appointment of Christian Dupont as CEO of the company.
After graduating from EPFL Christian Dupont joined Texas Instruments in 1988 where he started with sales and DSP marketing manager positions before participating to the creation of Wireless Business Unit in 1992. TI

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Top 10 Semiconductor R&D Spenders Increase Outlays 6% in 2017

February 17, 2018, anysilicon

Investment budget local government

The ten largest semiconductor R&D spenders increased their collective expenditures to $35.9 billion in 2017, an increase of 6% compared to $34.0 billion in 2016. Intel continued to far exceed all other semiconductor companies with R&D spending that reached $13.1 billion.  In addition to representing 21.2% of its semiconductor sales

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Inomize is Appointed as TSMC Value Chain Aggregator (VCA) Partner

February 16, 2018, anysilicon

TSMC-logo1

Inomize, a leading provider of turnkey, ASIC and SoC design solutions, is appointed by TSMC as one of its authorized VCA partners. As a TSMC VCA partner, Inomize is able to provide its customers with a full turnkey solution from initial design to volume production in TSMC’s most advanced silicon

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OSAT Companies Ranking 2016-2017

February 15, 2018, anysilicon

Many old CPU chips and obsolete computer processors as background

Despite the common belief, OSAT (Outsourced Semiconductor Assembly and Test) companies are very innovative. Many look at TSMC or Synopsys and consider their R&D work as innovative. But actually, semiconductor assembly industry is as innovative as any other company in the industry. We just don’t hear about it.
 
Semiconductor

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Worldwide Semiconductor Wafer Capacity Trends

February 12, 2018, anysilicon

news

Semiconductor industry wafer capacity, specifically in the memory segment, was inadequate to meet demand throughout 2017. However, with Samsung, SK Hynix, Micron, Intel, Toshiba/WD, and XMC/Yangtze River Storage Technology planning to significantly ramp up 3D NAND flash capacity over the next few years, and Samsung and SK Hynix boosting DRAM

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Understanding Custom Chip Design Economics For IoT And Industry 4.0

February 07, 2018, anysilicon

Examining a microchip

espite consumer media highlighting some of the more ludicrous “innovations” of the Internet of Things (IoT), including wirelessly connected toothbrushes and cocktail stirrers, the industrial market is forecast to be the largest adopter of the IoT “connected” phenomenon. Germany’s Industry 4.0 initiative is an influential driver in the manufacturing sector,

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