August 21, 2017, anysilicon
Abstract
Expanding its ChipArray® Ball Grid Array (CABGA) package form factor miniaturization efforts, Amkor now offers a maximum 0.40 mm height CABGA assembly process. Amkor’s latest CABGA process has been extensively demonstrated, evaluated and optimized to provide reliable, high-quality production. By extending CABGA capabilities to various competing near die size
August 16, 2017, anysilicon
Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, today announced its upgradation to ISO 9001:2015 certification. By meeting the extensive criteria for the ISO 9001: 2015 standards, the company reinforces its ability to deliver IC design services with continuous improvements in its offerings and
Read MoreAugust 15, 2017, anysilicon
IC Insights has revised its outlook and analysis of the IC industry and presented its new findings in the Mid-Year Update to The McClean Report 2017, which originally was published in January 2017. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World
Read MoreAugust 07, 2017, anysilicon
Sales of memory ICs are expected to show the strongest growth rate among major integrated circuit market categories during the next five years, according to IC Insights’ new 2017 McClean Report, which becomes available this month. The 20th anniversary edition of The McClean Report forecasts that revenues for memory products—including DRAMs and NAND
Read MoreAugust 03, 2017, anysilicon
A linear voltage regulator is a circuit that takes in a variable input voltage and provides a continuously controlled, steady, low-noise DC output voltage. Generally, linear voltage regulators require a large voltage drop between the input and the output to function correctly. This requires a relatively high-voltage input power supply
Read MoreJuly 31, 2017, anysilicon
GLOBALFOUNDRIES and VeriSilicon today announced a collaboration to deliver the industry’s first single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF’s 22FDX® FD-SOI technology, the companies plan to develop intellectual property that could enable a complete cellular modem module on a single chip, including integrated baseband,
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