TSMC Showcases New Technology Developments at 2023 Technology Symposium


SANTA CLARA, CA, Apr. 26, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today showcased its latest technology developments at its 2023 North America Technology Symposium, including progress in 2nm technology and new members of its industry-leading 3nm technology family, offering a range of processes tuned to meet diverse customer demands. These

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Omni Design’s High Performance Analog Front Ends are Adopted in Socionext’s Next Generation Communications SoCs

SAN JOSE, California – April 20, 2023 – Omni Design Technologies, a leading provider of low-power, high-performance mixed-signal Intellectual Property (IP) solutions, today announced that Socionext is adopting Omni Design’s high performance analog front end IP solutions in advanced FinFET nodes, to deliver the next generation of innovative communications products.
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SatixFy and Presto Engineering Partner to Test and Qualify Radiation Hardened Space-Grade ASICs for Next-Gen Satellite Communications

Rehovot, Israel – April 13, 2023 – SatixFy Communications Ltd. (“SatixFy”) (NYSE AMERICAN: SATX), a leader in next-generation satellite communication systems based on in-house developed chipsets, is pleased to announce a strategic partnership with Presto Engineering, a recognized expert in ASIC design and semiconductor engineering and production services. This partnership supports SatixFy’s growth of the Satellites constellation-based

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APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC


Woodcliff Lake, New Jersey — April 12, 2023 — Semiconductor intellectual property provider CAST today announced that design services provider APlabs, Inc., has chosen CAST IP for a new automobile system-on-chip APlabs is developing for a major Korean automaker.
Repeat customer APlabs most recently licensed these cores from CAST

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Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system

press release

Grenoble, France – April 12, 2023 – Tiempo Secure and GreenWaves Technologies are proud to have demonstrated how a Secure Element brings additional security in a project supported by the French Government, the community of communes Grésivaudan and the Auvergne Rhone Alpes Region. While in classical architecture, developers of SoCs (System-on-Chips)

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Steady growth in next-gen Fan-Out packaging

FO packaging revenue was US$1.86 billion in 2022. Yole Intelligence, part of Yole Group, expects it to have a CAGR of 12.5% through 2028, reaching US$3.8 billion. UHD FO will experience the fastest growth across all market classes, with a CAGR of 30%, growing from US$338 million in 2022 to

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