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MosChip Technologies announces its new Managing Director & CEO
Hyderabad, October 26, 2023 — MosChip Technologies Limited is pleased to announce the appointment of Mr. Srinivasa Rao Kakumanu, commonly referred to as “KS,” as the new Chief Executive Officer (CEO) and Managing Director (MD). KS, with an extensive background in the Semiconductor and Embedded industry spanning nearly 30 years, brings
Read MoreSofics releases its ESD technology on TSMC 3nm process
Belgium, October 24, 2023 – Sofics bv, a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) solutions portfolio is now available for TSMC’s advanced 3nm process technology.
Interface ESD protection in the most advanced FinFET technology is challenging: ESD sensitivity is very high while
Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors
BURLINGTON, VT–Green Mountain Semiconductor Inc. (GMS), a custom circuit design provider, is proud to announce its recent achievement of a Phase I Small Business Innovation Research (SBIR) contract. This significant milestone underscores GMS’ commitment to pushing the boundaries of technology in support of space applications. The contract was granted under
Read MoreChoosing, Integrating and Managing Chiplets
Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or “chiplets.” These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex
Read MoreSondrel is one of the founding members of Arm Total Design
Reading, UK – 17 October 2023. Sondrel (AIM: SND), is pleased to announce that it is one of the founding members of Arm® Total Design, an ecosystem that is committed to bringing Arm Neoverse™ CSS-based designs to market. Arm Neoverse CSS features high-end Arm Neoverse cores that are designed for
Read MoreFlip Chip: The Ultimate Guide
Flip chip , also known as “controlled-collapse chip connection” (C4), is an advanced semiconductor packaging technique that allows the direct attachment of a semiconductor chip, typically an integrated circuit (IC), to a substrate or circuit board. Unlike traditional packaging methods like wire bonding, in flip chip technology, the active side
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