Sr ASIC Packaging Engineer [ Remote ]

Encore Semi, Inc. is looking for a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon in a fully remote position. The role involves managing the silicon-to-board interface and ensuring that advanced ASIC designs meet rigorous signal integrity, thermal, and reliability standards through expert simulation and innovative manufacturing techniques.

Responsibilities:

• Lead full-wave 3D electromagnetic simulations using ANSYS HFSS for ASIC package extractions.
• Optimize bump-to-ball transitions and high-speed SerDes paths using Agilent ADS.
• Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out Wafer-Level Packaging (FOWLP).
• Drive the Integration and Test phase by correlating simulation models with physical hardware measurements (VNA/TDR).
• Validate package-level power delivery networks (PDN).
• Utilize Additive Manufacturing to develop custom heat sinks, interposers, or rapid-prototype substrates, reducing the R&D cycle for complex ASIC form factors.

Qualifications:

• 10+ years in Electronics Packaging, specifically focused on high-bump-count ASICs and high-speed interfaces.
• B.S./M.S. in Electrical Engineering, Mechanical Engineering, or Materials Science.

Skills:

• Expert proficiency in ANSYS HFSS and Agilent ADS for package-level SI/PI analysis.
• Deep understanding of substrate materials (ABF, Coreless), thermal interface materials (TIMs), and underfill chemistry.