ASIC Package Design Engineer

Broadcom is seeking an experienced IC package-design engineer to develop complex flip-chip-BGA packages for high-performance ASICs, focusing on applications in artificial intelligence, networking, high-performance computing, and 5G base stations. The role involves collaboration with a global R&D team to create innovative package structures that meet high-speed and power delivery requirements.

Responsibilities:

• Overall design responsibility for ASIC package designs, focusing on signal integrity, power integrity, manufacturability, reliability, and thermal aspects.
• Design critical structures for SerDes, ADC/DAC, DDR, HBM, etc.
• Manage schedules, prioritize tasks, and track progress across multiple projects simultaneously.
• Engage in general flip-chip BGA package design and engineering.
• Act as project manager and customer interface for design projects.
• Contribute to efficiency improvements through process development, automation, and documentation.
• Perform physical design (layout) as a foundational responsibility.

Qualifications:

• BSEE or similar field with 12 years of experience in flip-chip-BGA package design, including high-speed SerDes, or MSEE with 10 years of experience.
• Knowledge of package-level signal integrity and power integrity for application in package designs.
• Experience with Cadence APD (Allegro Package Designer) preferred, or equivalent tools.
• Ability to collaborate with a worldwide team across multiple time zones, including co-design with internal and external designers.
• Strong self-management and organizational skills.
• Preferred: 1+ years of experience with Cadence SKILL for Allegro or similar design-automation coding experience.

Skills:

• IC package design
• Signal integrity
• Power integrity
• Project management
• Collaboration across time zones
• Cadence APD (Allegro)
• Design automation coding (Cadence SKILL preferred)