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Principal ASIC Engineer [Mixed-Signal]

Published Date: October 25, 2026
Voyant Photonics, New York, NY
Job Description:

Voyant Photonics is seeking a Principal Mixed-Signal ASIC Engineer to lead the development of custom ICs for silicon photonic chips. This role offers a unique opportunity to shape the ASIC strategy and build a team while working on cutting-edge technology for applications in robotics, autonomy, and AI data centers.

Responsibilities:

  • Drive analog tapeouts from concept to production across various technology nodes (130 nm and below)
  • Design ultra-low-noise transimpedance amplifiers (TIAs) with low pA/Hz noise performance
  • Develop mixed-signal circuits including amplifiers, ADCs, DACs, and power management blocks interfacing with photonic ICs
  • Establish the ASIC development environment by selecting EDA tools, defining design flows, and setting verification standards
  • Collaborate with photonics designers, systems engineers, and FPGA/digital design teams for seamless co-design
  • Provide HDL and architectural input to external digital design partners
  • Hire and mentor a small team of analog and digital IC designers

Qualifications:

  • 7+ years of experience in analog and mixed-signal IC design with an 80/20 analog-to-digital focus
  • Proven track record of leading multiple tapeouts from concept to production silicon
  • Deep expertise in low-noise analog circuit design, particularly TIAs or similar precision circuits
  • Knowledge of test plan development for analog ASICs at OSAT partners
  • Strong understanding of mixed-signal design including ADCs, DACs, bias circuits, and power management
  • Experience in both mature nodes and interfacing with advanced node digital design
  • Ability to deliver working silicon within 9-12 months
  • Excellent communication and collaboration skills

Skills:

  • Experience with photonic IC co-design or interfacing analog circuits with optical components
  • Knowledge of advanced packaging techniques (chiplets, heterogeneous integration, 2.5D/3D)
  • Background in design-for-manufacturability
  • Understanding of commercial IP ecosystems and license negotiation

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