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TSMC to Break Ground on 1.4nm “A14” Fab on November 5

October 21, 2025 — Hsinchu, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, today announced plans to break ground on its new 1.4 nanometer (A14) fabrication facility in Taichung, Taiwan, on November 5, 2025. The groundbreaking marks a major milestone in TSMC’s ongoing roadmap toward next-generation logic technologies for high-performance computing and artificial intelligence applications.

 

The new fab—located in the Central Taiwan Science Park (CTSP) and internally designated as Fab 25—represents a total investment of approximately NT$1.5 trillion (US $49 billion). Construction will begin immediately following the ceremony, with risk production scheduled for 2027 and mass production targeted for the second half of 2028.

 

“The A14 process node will define the next era of computing performance and energy efficiency,” said Dr. C.C. Wei, CEO of TSMC. “This new fab in Taichung demonstrates our commitment to advancing semiconductor technology while strengthening Taiwan’s position at the center of global chip innovation.”

 

About the A14 Process

The A14 node is the direct successor to the N2 platform and introduces up to 15% higher performance at the same power or up to 30% lower power at the same performance, with a 20% increase in logic density.



It will also debut NanoFlex Pro, TSMC’s enhanced nanosheet transistor architecture, enabling superior power, performance, and area (PPA) scaling optimized for AI accelerators, data-center processors, and flagship mobile devices.

 

Technology and Equipment

A14 manufacturing will continue using 0.33 NA EUV lithography combined with advanced multi-patterning, balancing cost efficiency and production maturity. The Taichung site is expected to deploy over 30 EUV scanners during ramp-up, making it one of the world’s largest concentrations of advanced lithography tools.

 

Economic and Workforce Impact

The Taichung project is expected to create 8,000 to 10,000 new jobs and contribute significantly to Taiwan’s high-tech supply chain. Local authorities anticipate that, once complete, the site will become the largest AI and HPC chip manufacturing cluster in the world.

 

Global Strategy

TSMC continues expanding its worldwide manufacturing footprint, with advanced-node development distributed across Taiwan, the United States, and Japan. While A14 production will remain in Taiwan, next-generation A16 and N2 processes are progressing in TSMC’s overseas fabs. The company emphasized that Taiwan will remain the core location for its most advanced technology nodes.

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