Hsinchu, Taiwan – October 22, 2025 – United Microelectronics Corporation (NYSE: UMC, TWSE: 2303) today announced the launch of its new 55 nm Bipolar-CMOS-DMOS (BCD) platform, designed to significantly elevate power efficiency and integration in next-generation smartphones, consumer electronics, automotive, and industrial applications.
As device functions proliferate and power-management demands intensify, UMC’s 55 nm BCD platform enables a higher level of mixed-signal and power integration—bringing analog, digital, and power functions together on a single chip.
Key features of the platform include:
“With the readiness of our 55 nm BCD platform, we mark a major milestone for UMC—rounding out our specialty BCD technology portfolio and boosting our competitiveness in the power-management market,” said Steven Hsu, Vice President of Technology Development at UMC.
UMC’s BCD portfolio now spans nodes from 0.35 µm, 0.25 µm, 0.18 µm, 0.11 µm down to 55 nm, offering customers robust voltage capabilities, broad IP resources, and strong design support.
The new 55 nm BCD platform is well-suited for:
By offering multiple process variants tailored to different market segments, UMC enables customers to choose the optimum balance of cost, performance, voltage capability, and integration.