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Silvaco Announces Launch of Initial Public Offering

Santa Clara, CA – April 30, 2024 — Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced it has launched the roadshow for its initial public offering (“IPO”) of 6,000,000 shares of its common stock.

CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc

This interview was held with Mayank Varshney, VP of Engineering, Mirafra Inc.
 

 
Please share with us a bird’s eye view about Mirafra Software Technologies?
 
Mirafra Software Technologies is possibly the largest Standalone Design Services company from India. Mirafra started couple of decades ago with a vision

IC Package Types and How to Choose One?

Introduction to Integrated Circuit Packaging
 
Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today. 
 
Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc.

CEO Talk: Bram De Muer of ICsense

This interview was held with Bram De Muer, CEO of ICsense
 

 
 
Tell me a bit about your background? How did you first get started with ICsense?
 
I am a microelectronics engineer by education. Engineering has always been in my blood, whether it was constructing novel

Multi Project Wafer (MPW) Service and Price

We wrote before about multi project wafer benefits for IC designers of using MPW multi-project-wafer services.
 
Multi Project Wafer service is allowing companies to share the expensive mask cost. Essentially, Multi project wafer (MPW) services integrate onto silicon wafers several different integrated circuit designs from various teams. These designs

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

Shanghai, China, March 28, 2024 — VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). This solution is applicable to mobile phones, Bluetooth earphones including True