VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge


Nuremberg, Germany, March 14, 2023–VeriSilicon (688521.SH) today announced its collaboration with Microsoft on Windows 10 IoT Enterprise platforms including hardware accelerators and long-term support for powerful embedded platforms. Leveraging VeriSilicon’s embedded software design capability and decades of experience in launching successful products, the company is enabling embedded applications developers and

Read More

Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce

market research

Mar. 13, 2023 —- According to TrendForce’s latest survey of the global foundry market, electronics brands began adjusting their inventories in 2Q22, but foundries were unable to rapidly adapt to this development because they reside in the more upper portion of the supply chain. Moreover, revising procurement quantities of long-term foundry contracts

Read More

Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit

press release

Grenoble, France – March 8, 2023 – As security is increasingly the central issue of any SoC (System on Chip) development, for example taking into account initiatives like the Cyber Resilience Act, Tiempo Secure has decided to enrich the RISC-V community with security expertise by developing a new version of its

Read More

CAST Announces Very Versatile I2S-TDM Digital Audio Transceiver IP Core

Woodcliff Lake, New Jersey — March 8, 2023 — Semiconductor intellectual property provider CAST today announced the immediate availability of a new digital audio transceiver IP core that provides both Inter-IC Sound (I2S) and Time-Division Multiplexed (TDM) interfaces.
The new I2S-TDM I2S/TDM Multichannel Audio Transceiver has critical features and

Read More

Bonding Diagram Tool

Welcome to our QFN bonding diagram generator:

First select your package type and size
Enter your die size in um
Upload your netlist, here is a template
Questions? bugs? We’d love to hear


Read More

CAST Enhances RISC-V Processor Line for Low-Power and Functional Safety Applications

Woodcliff Lake, New Jersey — March 3, 2023 — Semiconductor intellectual property provider CAST today announced the immediate availability of a new deeply embedded, low-power RISC-V processor IP core and enhancements to its functional safety RISC-V processor IP core.
New Low-Power Embedded RISC-V Processor
The BA5x™ RISC-V Deeply Embedded

Read More