SEOUL, SOUTH KOREA – March 25, 2025 – South Korean AI chip startup FuriosaAI has declined an $800 million acquisition offer from US tech giant Meta, choosing instead to pursue its vision as an independent company
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Discussions between FuriosaAI and Meta had been ongoing since early this year, with
Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform
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March 24, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, is making significant strides in its 2nm process technology, paving the way for its adoption in Apple’s iPhone 18 family, expected in the second half of 2026.
Recent reports indicate that TSMC has been steadily
21 Mar 2025 – We are thrilled to announce that Cadence has successfully demonstrated first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry’s 5nm automotive process. This milestone underscores our commitment to delivering high-performance, automotive-grade IP solutions that meet the stringent requirements of next-generation automotive and high-performance computing
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Cambridge, MA – March 18, 2025 – Zero ASIC, a U.S. semiconductor startup on a mission to democratize silicon, has announced PlatypusTM, the world’s first open-standard eFPGA IP product. Platypus is the FIRST and ONLY commercial eFPGA IP products with:
100% open and standardized FPGA architectures
100% open source
SoftBank Group announced it will acquire Ampere Computing, a Silicon Valley-based startup specializing in Arm-based server chips, for $6.5 billion. The deal, expected to close in the second half of 2025, signifies SoftBank’s increasing investment in artificial intelligence infrastructure and its belief in the growing importance of
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