This interview features Mr. Kazushige Koshika, President of TOPPAN Technical Design Center Inc.
Tell me a bit about your background? How did you first get started with TOPPAN Technical Design Center Inc.?
I had been involved in semiconductor design businesses for many years. Through my previous
Digital isolation is an essential part of many industrial, automotive, energy and power-electronics systems. Digital isolators allow signals to cross an electrical isolation barrier while helping protect low-voltage control electronics from ground-potential differences, high-voltage transients and electrical noise.
Traditionally, engineers have selected digital isolation and isolated interface devices from established
High-voltage DC/DC converters are widely used in industrial electronics, automotive systems, telecommunications, energy storage, battery-powered equipment and other applications where the input supply can be significantly higher than the low-voltage rails required by processors, sensors and control electronics.
Design engineers traditionally source these devices from established analog semiconductor manufacturers. However,
Power management is one of the largest and most diverse segments of the analog semiconductor market. Almost every electronic system requires some combination of DC/DC conversion, voltage regulation, battery charging, power switching, protection or power sequencing.
While companies such as Texas Instruments, Analog Devices, Infineon, STMicroelectronics, onsemi and Monolithic
IC short circuit failure analysis is the process of determining where an unintended electrical connection exists inside a semiconductor device, package or interconnect structure and identifying the physical defect that created the short.
A short circuit may initially appear only as excessive supply current, unexpectedly low resistance between two
Package failure analysis is the systematic investigation of defects and failures originating within semiconductor packaging, interconnects, solder connections, die attach, bond wires, redistribution layers and other structures that connect the semiconductor die to the outside system.
A semiconductor device may fail electrical testing even though the silicon itself is