Blog

GLOBALFOUNDRIES and Racyics GmbH Demonstrate Ultra-Low-Power Microcontroller for the Internet of Things

October 14, 2019, anysilicon

Santa Clara, Calif. and Dresden, Germany, Oct. 10, 2019 — A major limiting factor in the growth of Internet of Things (IoT) applications is the amount of power consumed by the edge devices used in IoT networks, and as a result, there is an urgent need to find ways to use

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IC’Alps joins Arm Approved Design Partner program to better support customers with ASIC development

October 08, 2019, anysilicon

Meylan, FRANCE – OCTOBER 08, 2019 – IC’Alps, the French one-stop shop ASIC partner offering custom Integrated Circuit development and supply, today announced it has been appointed an Arm® Approved Design Partner.
 
The Arm Approved Design Partner program is a global network of design service companies endorsed by Arm. Read More

Dialog Semiconductor to Acquire Creative Chips adding Industrial IoT Products to its Portfolio

October 07, 2019, anysilicon

London, United Kingdom – October 7, 2019 – Dialog Semiconductor plc, a leading provider of power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth® low energy technology, today announced it has signed a definitive agreement to acquire Creative Chips GmbH, a prominent supplier of Integrated Circuits (ICs) to the Industrial

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TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide

October 01, 2019, anysilicon

Hsinchu, Taiwan R.O.C., Oct 1, 2019 – TSMC, the world’s leading global innovator in semiconductor manufacturing, filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node

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HDL Design House Appoints Frank Werner as Worldwide Sales Director

October 01, 2019, anysilicon

Belgrade, Serbia – October 1st, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs,  announced the appointment of Frank Werner as Worldwide Sales Director, effective immediately. With more than 25 years of experience in different

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The Ultimate Guide to Lead Frame

September 28, 2019, anysilicon

Lead Frame Overview
 
A lead frame is a generic term for a type of (mostly) low-cost IC package assembly used for DIL types packages as well as PLCCs and QFNs.
 

The frame is typically made of a thin layer of copper, though other materials, such as aluminum

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