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TSMC Introduces N4X Process

HSINCHU, Taiwan, R.O.C., Dec. 16, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products. N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family. The “X”

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Sondrel reduces lead times in SOC development via an early assignment of bumps in BGA packages

man holding a chip

Because Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing and test process. It says that it has noticed increased lead times for SOC package design and manufacturing, particularly for flip

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AST SpaceMobile Selects EnSilica to Support the Development of its Next Generation Advanced Cellular ASIC Chip

Examining a microchip

OXFORD, United Kingdom – December 10th, 2021 – EnSilica, a leading provider of mixed-signal custom application-specific integrated circuits (ASICs) for the automotive, satellite communications and healthcare industries, today announced that it has been selected by AST SpaceMobile, Inc. (NASDAQ: ASTS) to develop the next generation ASIC for use in the company’s planned space-based

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Sondrel’s modules accelerate implementation of new ASIC designs

cpu or central processor unit

Reading, UK  7 December 2021. Sondrel has revealed that its recently launched family of Architecting the future™ IP platforms are very easy to modify to precisely match customers’ ASIC requirements. This is because of its innovative Scalable Architecture Framework™ (SAF) that they are all based on. This uses re-usable, modular

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IC Market Direction Indicator Points to 11% Growth in 2022

market research

IC Insights proudly celebrates its 25th anniversary by offering the 2022 edition of The McClean Report service. The McClean Report service begins with the Semiconductor Industry Flash Report, which will be released in January of next year, and will provide clients with IC Insights’ initial overview and annual forecast of the semiconductor industry for the upcoming

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intoPIX unveils “TicoXS FIP” during its ProAV virtual event this week

News

Mont-Saint-Guibert, Belgium, November 29, 2021 – Not yet officially announced but not exactly a secret either; intoPIX, leading expert in video compression for ProAV, has again extended its large range of JPEG XS codecs with the addition of the Flawless Imaging Profile (FIP) in its revolutionary “TicoXS FIP” Codec.
 

 
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