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Transistor Count Trends Continue to Track with Moore’s Law

The primary yardstick by which the IC industry measures its technological performance and progress remains Moore’s Law that states there is a doubling of the number of transistors per chip every two years. It pertains to the growth rate of components per chip, but it is sometimes generalized to describe the

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Faraday Announces Low-DPPM Solution for a Wide Range of ASIC Applications

araday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its low-DPPM solution for diversified applications. Instead of utilizing costly automotive standard compliance methods, this solution supports non-automotive ASIC projects by adopting much more cost-effective and efficient ways to achieve low defect rates and meet

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Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020

Annual semiconductor unit shipments, including integrated circuits and optoelectronics, sensors, and discrete (O-S-D) devices are forecast to rise 7% in 2020 and surpass one trillion units for the second time in history, based on data presented in the new, 2020 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of

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The Future Of Embedded Monitoring Part 2

This is a guest post by Stephen Crosher, CEO of Moortec
 
The rate of product development is facing very real challenges as the pace of silicon technology evolution begins to slow. Today, we are squeezing the most out of transistor physics, which is essentially derived from 60-year-old CMOS technology.

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Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT)

London, United Kingdom & Santa Clara, Calif. – February 20, 2020 – Dialog Semiconductor plc (XETRA:DLG), a leading provider of power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth® low energy technology, and Adesto Technologies Corporation (“Adesto”) (NASDAQ:IOTS), a leading provider of innovative custom integrated circuits (ICs) and embedded systems

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System-in-Package (SiP), a success story

“The demand for SiP[1] has increased significantly in recent years, with an adoption in a wide ranging of applications”, announces Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “SiP involves low-end including smaller package size & lower I/O count and high-end applications with larger package size & higher I/O. SiP is also leveraging

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