The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing
Read More
This interview was held with Martin Sallenhag, CEO, RoodMicrotec N.V.
Tell me a bit about your background? How did you first get started with RoodMicrotec?
After my master’s degree in electrical engineering at Lund University, I joined the mobile phone division of Ericsson where I designed
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its AIoT platform ASIC solution has successfully delivered more than 10 projects in AIoT applications. These demonstrated solutions span UMC process technologies from 55nm to 28nm, including edge applications in audio and vision recognition, smart
Read More
This is a guest post by Stephen Crosher, CEO of Moortec
Shall I compare thee to a…Rolls Royce jet engine?
‘There is a new era dawning whereby deeply embedded sensing within all technology will bring about great benefit for the reliability and performance of semiconductor-based products.’ These were my
IC Insights recently released its new Global Wafer Capacity 2020-2024 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, process geometry, region, and product type through 2024.
Included in the report is a ranking of the 25 largest wafer capacity leaders in terms of monthly
February 10, 2020 — Wokingham, UK – EnSilica, a leading provider of custom ASIC design and supply services has announced it is developing a single-chip Ka band transceiver IC for the European Space Agency. The mmWave IC will form a key component of next-generation, low-cost hybrid automotive communication terminals – enabling
Read More