This interview was conducted with Udi Shaked, CEO of Inomize.
Full Name: Udi Shaked
Title: CEO
Company: Inomize
Tell me a bit about your background. How did you first get started with Inomize?
We came up with the idea of launching Inomize back in 2007,
The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
The first eWLB package was used in mobile phones in 2009 and since
T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is the
ne of the key features of the Arm ecosystem is its open and collaborative nature, and that’s no more evident than in its bank of Approved Design Partners. They bring an additional layer of design expertise and capabilities to SoCs from Arm silicon partners, enabling them with more opportunities to
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