The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
The first eWLB package was used in mobile phones in 2009 and since
T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is the
ne of the key features of the Arm ecosystem is its open and collaborative nature, and that’s no more evident than in its bank of Approved Design Partners. They bring an additional layer of design expertise and capabilities to SoCs from Arm silicon partners, enabling them with more opportunities to
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The semiconductor industry is in constant growth and has a very promising future. Industry’s market experts have agreed the market size will grow even more in next decade. Some believe the IoT and Automotive market segments are the key growth and will eventually change our lives forever. After all, semiconductors
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Elsys with its comprehensive digital and mixed-signal SoC services and solutions stands for a reliable and agile design services company. Recognized on the market for its expertise and stability, Elsys has become a proud partner of Arm and IAR Systems.
Known for its best-in-class engineering support in domains of digital, analog and mixed-signal design,
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it will showcase their AI FPGA-to-ASIC solution and the Uranus+™ ultra-low-power IoT SoC development platform at Design Automation Conference (DAC), June 25-27, 2018 in San Francisco, CA, USA.
Faraday’s FPGA-to-ASIC conversion service has successfully completed several AI related