The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using
Read More
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at Design & Reuse IPSoC 2018 on 5th April in Santa Clara, California. Sankalp Semiconductor’s booth will be displaying expertise related to the digital, analog and mixed signal, custom layout, standard
Read More
IP-Maker is introducing a new product line of NVMe Host IPs. In addition to the Easy NVMe Host IP, targeting embedded applications and launched in 2017, today IP-Maker announces the availability of two new products targeting data center applications: the Advanced NVMe Host IP, and the Multi Root NVMe Host
Read More
Many IC designers pay little attention to ASIC qualification and consequently pay high price and delays before the chip reaches to high volume. The mindset of experienced IC designers is considering IC quality (and reliability) through all phases of the IC design process. Today, more than ever, re-tapeout is costly
Read More
Mindtree Ltd., has announced the BQB (Bluetooth Qualification Body) qualification of its Bluetooth Mesh v1.0 Software Stack along with its Bluetooth v5.0 Software Stack & Profiles (Declaration ID #D038060). These IP cores have already been licensed to major semiconductor companies and will be showcased in the upcoming Bluetooth Asia (May
Read More
An Application-Specific Integrated Circuit (ASIC) is an integrated circuit (IC) which is designed and customized for a particular use rather than being used for general-purpose applications. An example for ASIC is a chip that is designed to run a high-efficiency Bitcoin miner, or a chip designed specifically for BMW’s brake
Read More