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Amkor Factories Receive Key Automotive Certification

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Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that multiple factories have passed certification audits for IATF-16949:2016, a key certification required for manufacturers who supply products to the automotive market. IATF-16949:2016 replaces and supersedes the older ISO/TS-16949 standard.


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Understanding High Temperature Storage Life (HTSL) in IC Qualification

For ASIC or IC, there are recommended environmental conditions for their storage which allows them to perform at proper functionally. However, it is well known that storage may not always be close to the recommended standard. This is where the high temperature storage life testing (HTSL reliability testing) comes into

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Understanding Highly Accelerated Stress Test (HAST) in IC Qualification

The Highly Accelerated Stress Test (HAST testing) involves the effects of humidity and temperature on an IC or ASIC. The HAST test is designed to test the package of the ASIC under extreme humidity and temperature conditions. Devices that pass such HAST tests will be able to withstand the normal

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Understanding ESD CDM in IC Design

In addition to the human body model (HBM) which is used to measure the electro-static discharge (ESD) that may affect IC/ASIC devices, there is also damage that may come from charged device model (CDM) which also must be tested. Although superficially similar to the HBM, the CDM is different and

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Understanding ESD HBM in IC Design

In building integrated circuits (ICs) or ASICs, one area of concern is how they are protected from outside electrical sources. While most systems are geared towards power overloads, one source that may cause considerable damage is the electro-static discharge (ESD) that comes from the human body. To help test for

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Faraday Leads ASIC Industry with Supporting Major Projector Technologies

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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today unveiled the success of projector ASICs, covering high-end 4K/8K projector, head-up display (HUD), AR, and 3D sensing pico-projector applications for top-tier projector manufacturers in Japan, USA, and Taiwan. By leveraging its design methodology and IP customization

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