Blog

Worldwide Semiconductor Wafer Capacity Trends

Semiconductor industry wafer capacity, specifically in the memory segment, was inadequate to meet demand throughout 2017. However, with Samsung, SK Hynix, Micron, Intel, Toshiba/WD, and XMC/Yangtze River Storage Technology planning to significantly ramp up 3D NAND flash capacity over the next few years, and Samsung and SK Hynix boosting DRAM

Understanding Custom Chip Design Economics For IoT And Industry 4.0

espite consumer media highlighting some of the more ludicrous “innovations” of the Internet of Things (IoT), including wirelessly connected toothbrushes and cocktail stirrers, the industrial market is forecast to be the largest adopter of the IoT “connected” phenomenon. Germany’s Industry 4.0 initiative is an influential driver in the manufacturing sector,

Find the right ASIC Supply Chain Service provider for your project

 How many ASIC supply chain providers are typically included in a shortlist when launching a project?

We’d argue that too few.
 
There are over 100 ASIC supply chain providers worldwide that provide a range of services in different domains– ASIC supply chain for low volume, high volume, automotive, industrial,

Sankalp Semiconductor opens a New Design Center in Ahmedabad

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today announced opening of a new design center in Ahmedabad. The company already has three design centers in India (Hubli, Kolkata and Bangalore). Sankalp Semiconductor has executed multitude of complex digital and mixed signal

ASE and Cadence Deliver First System-in-Package EDA Solution Tailored for ASE’s High-Performance, Advanced IC Package Technologies

Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311, NYSE: ASX), and Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. The solution consists of the SiP-id™ (System-in-Package – intelligent

CEO Talk: Frederic MAURON

This interview was held with Frederic MAURON, a Senior International Sales with Aptasic SA.
 
 
Tell me a bit about your background? How did you first get started with Aptasic?
 
I have a technical background in micro-electronic and completed a business management graduation in 1993.
 
Tell me about Aptasic?