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asicNorth Announces a Development Ecosystem to streamline the creation of mixed-signal IoT SoC’s

Williston, VT October 17, 2016:  asicNorth announced today they have created a complete development ecosystem specifically targeted toward custom “Internet of Things” (IoT) devices.  The asicNorth “IoT Design EcoSystem” is formed by linking key partners in system design, semiconductor design and process technology areas.  Joining asicNorth are SoC Solutions, Faraday

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Analog IC: TI Maintains Analog IC Leadership

The 2015 analog IC market grew 2% to $47.0 billion.  Combined sales of general-purpose analog IC products (amplifiers/comparators, interface, power management, an signal conversion devices) increased 2% to $19.1 billion and sales of application-specific analog devices also improved 2% to $27.9 billion. Among analog IC products the market for signal

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Asia-Pacific To Top 2016 Regional IC Sales In Major Categories

Asia-Pacific’s grip as the dominant market for IC sales is forecast to strengthen in 2016 with the region expected to account for 61.0% of the $282.0 billion IC market this year, based on analysis published in IC Insights’ mid-year Update to the 2016 IC Market Drivers report.

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CSEM licenses IcyTRX™ Bluetooth Low Energy silicon RF IP to Oticon

Neuchatel, 11 October 2016 – CSEM, the Swiss Research and Technology Organization, today announced that they have licensed their IcyTRX™ silicon RF IP core to Danish hearing aid manufacturer Oticon.
 
Oticon has integrated IcyTRX™ IP core into their new chipset for the new Oticon Opn™ range of advanced wireless-enabled

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Introduction to ASIC Design Flow

Asic design flow

Today, ASIC design flow is a mature process with many individual steps. ASIC design flow process is the backbone of every ASIC design project. To ensure design success, one must have: a silicon-proven ASIC design flow, a good understanding of the ASIC specifications and requirements, and an absolute domination over

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Number of 300mm Wafer Foundries Increases

Enormous financial and technology hurdles continue to plague the development of 450mm wafers. Ambitious goals to put 450mm wafers to use have been scaled back.  IC manufacturers are instead maximizing their manufacturing efficiency using 300mm and 200mm wafers.  IC Insights’ Global Wafer Capacity 2016-2020 report shows that

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