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NVM Express IP for Enterprise SSDs – Overview and Implementation

The NVM Express (NVMe) specification has been introduced in 2011. Five years later, it is definitely adopted as the new standard storage interface for Solid-State Drives (SSD). Even if SAS and SATA SSDs are still dominating the market (in unit shipment), the PCIe SSD market share is growing fast and

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Understanding IC Cost

There have been many debates around the final cost of an IC. Over the years the misconception and failure to agree on what the calculated IC cost would be. The reason for this is that ICs are a simple concept anymore. Technology moves at an extremely fast pace and chip

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Designing for Power Integrity: Status, Challenges and Opportunities

It has been almost two decades since the target impedance concept was first proposed for the design of power distribution networks. Both academia and industry have come a long way since then by proposing solutions for managing power integrity in packages and printed circuit boards (PCB). This paper briefly reviews

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Speed in IC’s : A major concern

Firstly let me ask what strikes your mind first when I say performance?
Intel started designing processors with MHz to GHz frequencies (Improving the performance of course, but if we see the advantage there might be some flaws too). Yes serially it was possible to send and receive the data

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TI Factory in Greenock to Close Down or Transfer

Hundreds of jobs are under threat after Texas Instrument announced the closure of its Greenock factory.
 
TI said it would be closing the fab over the next three years, and moving its operations to fabs in Germany, Japan and Maine, in order to save money. Approximately 400 people are

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The Ultimate Guide to QFN Package

QFN Package Overview
 
The QFN (Quad Flat No-lead) package is probably the most popular semiconductor package today because of four reasons: low cost, small form factor and good electrical and thermal performance. In this article we will provide an overview to QFN packaging, discuss QFN package technical details and

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