The leading nanoelectronics research center, imec, and digital research and incubation center, iMinds, today announced that its respective board of directors have approved the intention to merge the research centers. Using the imec name, the combined entities will create a world-class, high-tech research center for the digital economy. The transaction
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Since the invention of the first semiconductor package in 1965, the semiconductor packaging technology has grown dramatically and several thousands of different semiconductor package types have been made. The chart below presents the semiconductor packaging history. Particularly it shows the two major trends in semiconductor packaging: addressing high pin
Research in the field of 2D materials that started approximately five years ago, focusing on developing materials that are one layer thick which would make it faster for atoms to move in a single layer. Currently, transistors and other components used in electronic devices have been made of 3D materials
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Semiconductor industry spending on research and development grew by just 0.5% in 2015, which was the smallest increase since the 2009 downturn year and significantly below the compound annual growth rate (CAGR) of 4.0% in R&D expenditures during the last 10 years, according to IC Insights’ new 2016 edition of The
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Today, the (SiP) System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations
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SilabTech, leading supplier of High Speed Interface intellectual property designs (IPs), announced today that it was awarded with the 2015 IESA Award for the Most Innovative Product for its High Speed Interface (SERDES) Design which is leading the industry in its Low Power figures while enabling customers to use it in wide variety
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