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Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production

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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed

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Samsung Foundry Accelerates 2nm Production, Faces Challenges in Advanced Node Deployment

Samsung Foundry is accelerating its efforts to establish mass production capabilities for its 2nm process technology, according to industry sources. The company is actively equipping its “S3” foundry line at the Hwaseong plant, aiming for a monthly capacity of 7,000 wafers by Q1 2024. Further expansion is planned with the

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Global Semiconductor Sales Hit Record High in August, Fueled by AI Boom

Global semiconductor sales soared to a record $53.1 billion in August, marking a significant 20.6% year-over-year increase, according to the Semiconductor Industry Association (SIA). This surge, the highest since April 2022, underscores the robust momentum in the semiconductor industry, driven primarily by the burgeoning demand from the artificial intelligence (AI)

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The Ultimate Guide to QFP Package

QFP Package

What is QFP IC Package?
In semiconductor technology, packaging with compact size and high performance is in high demand. Among several discovered semiconductor packaging technologies, Quad Flat Package (QFP) has been vibrant in electronics packaging, as presented in Figure 1.
 
QFP package is a mature semiconductor packaging technology for

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A Guide to BCD, CMOS, FinFET, SOI, GaN and SiC

Introduction to Semiconductor
Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors.

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Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

TSMC

TEMPE, Ariz. & HSINCHU, Taiwan–(BUSINESS WIRE)–Oct. 3, 2024– Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
 
This press release features multimedia. View the full

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