Blog

Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform

September 13, 2024 — Enosemi, a silicon photonics chiplet and IP provider, announced today the availability of a portfolio of high-speed electronic and photonic design IP in the GF Fotonix(TM) IP catalog. The silicon-proven design IP enables Fotonix users to accelerate their time-to-market for next-generation photonic integrated circuits. Enosemi has multiple

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Vanguard and Episil Join Forces to Build 8-Inch Silicon Carbide Fab in Taiwan

Vanguard International Semiconductor Corp (VIS) and Episil Technologies Inc. announced today a strategic partnership to build an 8-inch silicon carbide (SiC) wafer fabrication facility in Taiwan. The collaboration, facilitated by an equity acquisition deal, will see VIS acquire a 13% stake in Episil for NT$2.48 billion (US$77.1 million).
 
The

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Semiconductor Foundries Monthly Sales Report of August 2024

This weeks, Taiwan’s foundries and OSAT’s reported their August revenue.  TSMC showing very strong year on year (YoY) growth due to it’s dominance of advanced technology for AI and smartphone applications.  
 
TSMC Dominates with Advanced Technology
TSMC, the world’s largest contract chipmaker, reported August revenue of US$7.8 billion, a

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Presto Engineering Joins MEDICALPS Cluster to Support Medical Device Innovations

press release

Meyreuil, France – September 12th – Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, proudly announces becoming member of the MEDICALPS cluster. This initiative is part of Presto Engineering’s ongoing commitment to understanding the challenges and needs of medical device companies, ensuring continued

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Finland: Fab expansion adding 200 mm wafer capacity significantly

news

Okmetic is currently building a fab expansion, that will more than double our Vantaa site capacity. The fab expansion will be in operation in 2025 and focus on 200 mm crystal growth as well as 200 mm SSP and DSP wafers.
 
Vantaa site in summer 2024
 
In addition

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GaN, from innovation to mass production

Today, GaN is set to be an indispensable technology for power and RF applications in the coming years. Established Si and SiC companies are eager to enter this emerging market, but moving from innovation to mass production raises significant challenges. Last June, Ezgi Dogmus from Yole Group, along with

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