Arm Holdings Plc has terminated its architectural license agreement with Qualcomm Inc., ending Qualcomm’s ability to use Arm’s intellectual property for chip design. The termination, reported by Bloomberg, follows a 60-day notice from Arm. This action escalates an existing legal dispute between the two companies, set to begin in Delaware
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Shanghai, China, October 22, 2024–VeriSilicon (688521.SH) today announced that its DeWarp Processing IP DW200-FS has achieved ISO 26262 ASIL B automotive functional safety certification. The certificate was issued by TÜV NORD, an international inspection and certification institution.
VeriSilicon’s DW200-FS IP leverages advanced pixel mapping algorithms and cache-based data prefetch architecture,
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the construction of a new silicon
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Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping the landscape of computing, from smartphones to servers.
In the realm of electronics, understanding the building blocks is key.
[Santa Clara, USA], [October 21st, 2024] – MosChip® Technologies is now an AI/ML design partner under Renesas RZ partner ecosystems, delivering intelligent solutions based on Renesas RZ/V series of MPUs.
MosChip® Technologies is a semiconductor design and product engineering services company with expertise in SoC design, systems, software, mobility, connectivity,
Taiwan Semiconductor Manufacturing Company (TSMC) today announced that customer inquiries for its next-generation 2nm process are exceeding even those for its already successful 3nm technology. This exceptional demand underscores the industry’s confidence in TSMC’s technological leadership and its ability to meet the rapidly growing needs of the AI and high-performance
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