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Chiplet Summit 2025

chiplet

January 21, 2025 – January 23, 2025
Why should we go this summit

Why to Attend:

Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts

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UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance

press release

Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough in the advanced packaging market, securing a major contract from Qualcomm Incorporated (NASDAQ:QCOM) for high-performance computing (HPC) applications. This win marks a pivotal moment, challenging the long-held dominance of Taiwan Semiconductor Manufacturing Company (TSMC) in this critical sector.
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Cadence Appoints Moshe Gavrielov to Board of Directors

cadence moshe

12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the appointment of Moshe Gavrielov to its board of directors, effective January 1, 2025. Mr. Gavrielov currently serves as a member of the board of NXP Semiconductors N.V. and Taiwan Semiconductor Manufacturing Company Ltd., as chair

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Apple’s First AI Server Chip to be Engineered in Israel

Apple Silicon Journey

Dec-12, 2024 — Apple is accelerating its foray into the artificial intelligence (AI) market with the development of its first custom server chip, codenamed “Baltra,” designed specifically for AI processing. This groundbreaking initiative, reported by The Information and further detailed in recent reports, marks a significant step in Apple’s efforts

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Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

The man with a carrier of the silicone wafers

Dec-11, 2024  — Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed three separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide up to $33 million in proposed direct funding to Coherent, up to $16 million in proposed direct funding to

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MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC

moschip cadence

Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA tools for the design of the High-Performance Computing (HPC) Processor “AUM” for C-DAC.
 
MosChip® Technologies is the first fabless semiconductor company publicly traded in India. It has over twenty-five years of experience designing products and SoCs with

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