Okmetic is currently building a fab expansion, that will more than double our Vantaa site capacity. The fab expansion will be in operation in 2025 and focus on 200 mm crystal growth as well as 200 mm SSP and DSP wafers.
Vantaa site in summer 2024
In addition
Today, GaN is set to be an indispensable technology for power and RF applications in the coming years. Established Si and SiC companies are eager to enter this emerging market, but moving from innovation to mass production raises significant challenges. Last June, Ezgi Dogmus from Yole Group, along with
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CAMPBELL, Calif., Sept. 10, 2024 — Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that VeriSilicon (688521.SH), a one-stop custom silicon service and semiconductor IP licensing service provider, has licensed Arteris FlexNoC 5 interconnect IP. This physically aware interconnect IP offers enhanced
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Munich, Germany and Villach, Austria – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services – design,
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September 9th 2024, SILICON VALLEY, Calif. and MALTA, N.Y., September 9, 2024 – GlobalFoundries (Nasdaq: GFS) (GF) and Silicon Catalyst, the world’s only incubator+accelerator focused exclusively on semiconductor solutions, today announced that GF has joined the incubator’s semiconductor startup ecosystem as a Strategic Partner and an In-Kind Partner (IKP). The partnership will
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