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TSMC to Launch First European Design Center in Munich by Q3 2025

Munich, Germany – May 28, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC) today announced the establishment of its inaugural European Design Center, set to commence operations in Munich during the third quarter of 2025. This strategic move underscores TSMC’s commitment to supporting European clients in developing high-density, high-performance, and energy-efficient

Europe Lags Behind as Global Semiconductor Equipment Market Soars

MILPITAS, Calif. – April 9, 2025 – Worldwide sales of semiconductor manufacturing equipment increased 10% to $117.1 billion in 2024 from $106.3 billion in 2023, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today. The data is now available in the Worldwide Semiconductor Equipment Market Statistics

EnSilica Expands with New Cambridge Engineering Hub

May-28-2025 — CAMBRIDGE, UK – EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has established a new engineering hub in Cambridge, UK.
 
Drawing on Cambridge’s renowned semiconductor ecosystem, EnSilica has opened a new engineering facility in the city and

Brite Semiconductor Releases TCAM IP based on 28HKC+ Process

Shanghai, China — May 27, 2025 — Brite Semiconductor (Shanghai) Co., Ltd. (BriteSemi, 688691), a leading provider of custom ASIC and IP solutions, today announced the launch of Ternary Content-Addressable Memory (TCAM) IP developed on 28HKC+ 0.9V/1.8V platform. This IP has the features of high frequency and low power consumption. With the

Analogue Insight and Tetrivis Announce Joint Development of “Eurytion RFK1,” a UCIe based 12 nm Ka/Ku-Band RF Chiplet Transceiver

LONDON & BASINGSTOKE — 23 May 2025 — Analogue Insight Ltd. and Tetrivis Ltd. today unveiled a strategic collaboration to co-develop Eurytion RFK1, a 12 nm RF chiplet transceiver that delivers wide-band Ka/Ku operation with an integrated local oscillator and up to 2 GHz of instantaneous, fully-programmable bandwidth. Leveraging Tetrivis’

Wafer Testing: Ultimate Guide

What Is Wafer Testing?
 

 
Wafer testing—often called wafer sort or probe testing—is the process of electrically evaluating individual semiconductor dies directly on the wafer. Using precision probe needles to make contact with bond pads or dedicated test structures, wafer testing allows engineers to:
 

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