Blog

Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development

Faraday Technology Corporation (TWSE: 3035), leading ASIC design service and IP provider, today launched SoCreative!VI™ A600 SoC development platform implemented in Samsung Foundry’s 14LPP FinFET process technology. This platform is equipped with Faraday’s A600 SoC chip on an evaluation board and the Linux software development kit (SDK) to create a full-performance system

ATS Engineering and ChipTest Announce Strategic Collaboration for Test Program Development for Advantest’s customers

Tel Aviv, Israel – March 24, 2022 – ATS Engineering, a leading Israeli test house, and ChipTest Semiconductor IC Test Company, have announced an exclusive collaboration agreement for developing test programs and test interfaces (load boards and probe cards) on the ATS’ Advantest V93000 Smart Scale platform, to support ATS

Introduction to System in Package (SiP)

System in Package (SiP) is a method used for bundling multiple integrated circuits (ICs) and passive components into a single package, under which they all work together. This contrasts to a System on Chip (SoC), whereas the functions on those chips are integrated into the same die.
 

Figure

Understanding Wafer Level Packaging

Wafer Level Packaging or WLP,  is a type of IC packaging technology that is performed at wafer level. This means that the packaging is applied on whole wafers and wafers are diced only after the packaging is successfully competed. In wafer level packaging, the components used in assembly (such as

Silex Insight launches DDR encrypter for High-Performing Systems (ASIC/FPGA)

Silex Insight, a leading provider of cryptographic IP solutions, is now extending their offering by launching a high throughput DDR encrypter (100Gbps). The DDR encrypter IP Core module enables on-the-fly encryption and authentication to the external memory. It is highly configurable and may be optimized for various size, throughput, and

Semicondcutor Foundry Sales Forecast 2016-2022

IC Insights’ forecast for the foundry market through 2026 was part of its recently released 1Q Update to the 2022 McClean Report.  The Update also included analyses of the top-25 2021 semiconductor suppliers, semiconductor industry capital spending, IC industry capacity, the automotive IC market, and detailed forecasts for the DRAM, flash, MCU, MPU, and analog