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Actions Technology’s smart watch SoC adopted VeriSilicon’s 2.5D GPU IP

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Shanghai, China, May 15, 2024–VeriSilicon (688521.SH) today announced that Actions Technology (688049.SH), a low-power AIoT fabless semiconductor company, has adopted VeriSilicon’s power-efficient and feature-rich 2.5D Graphics Processor Unit (GPU) IP in its highly integrated dual-mode Bluetooth smart watch SoC series, ATS3085S and ATS3089.
 
Featuring low power consumption and high frame rate,

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Wafer Dicing: Ultimate Guide

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Wafer dicing is a critical process within the semiconductor manufacturing. It’s the step where silicon dies are separated from each other. Semiconductor wafer dicing techniques have evolved over time, from traditional blade dicing to more advanced methods such as laser and plasma dicing, each with its own benefits and applications.
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ASIC = Competitive Edge

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In today’s highly competitive market, businesses are continually seeking ways to gain an edge over their rivals. One possible strategy is using Application-Specific Integrated Circuits (ASICs). These specialized chips offer numerous benefits, allowing companies to create products that not only outperform the competition but also operate with better power efficiency

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Custom ASIC: The Ultimate Guide

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Imagine a world where every electronic device is tailored to its purpose with pinpoint precision. Custom ASICs, or Application-Specific Integrated Circuits, makes this a reality.
 
Custom ASICs represent a step beyond generic circuitry to meet unique demands. They offer customization levels from the architecture to the very silicon upon

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Semiconductor Qualification Academy

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Are you navigating the semiconductor qualification maze effectively? A lack of attention to ASIC qualification could lead to significant setbacks in cost and time for chip deployment. Our latest article sheds light on the critical importance of ASIC qualification and how it impacts your chip’s journey to high volume.
As

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Silvaco Announces Launch of Initial Public Offering

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Santa Clara, CA – April 30, 2024 — Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced it has launched the roadshow for its initial public offering (“IPO”) of 6,000,000 shares of its common stock.

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