Wafer dicing is a critical process within the semiconductor manufacturing. It’s the step where silicon dies are separated from each other. Semiconductor wafer dicing techniques have evolved over time, from traditional blade dicing to more advanced methods such as laser and plasma dicing, each with its own benefits and applications.
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In today’s highly competitive market, businesses are continually seeking ways to gain an edge over their rivals. One possible strategy is using Application-Specific Integrated Circuits (ASICs). These specialized chips offer numerous benefits, allowing companies to create products that not only outperform the competition but also operate with better power efficiency
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Imagine a world where every electronic device is tailored to its purpose with pinpoint precision. Custom ASICs, or Application-Specific Integrated Circuits, makes this a reality.
Custom ASICs represent a step beyond generic circuitry to meet unique demands. They offer customization levels from the architecture to the very silicon upon
Are you navigating the semiconductor qualification maze effectively? A lack of attention to ASIC qualification could lead to significant setbacks in cost and time for chip deployment. Our latest article sheds light on the critical importance of ASIC qualification and how it impacts your chip’s journey to high volume.
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Santa Clara, CA – April 30, 2024 — Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced it has launched the roadshow for its initial public offering (“IPO”) of 6,000,000 shares of its common stock.
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This interview was held with Mayank Varshney, VP of Engineering, Mirafra Inc.
Please share with us a bird’s eye view about Mirafra Software Technologies?
Mirafra Software Technologies is possibly the largest Standalone Design Services company from India. Mirafra started couple of decades ago with a vision