Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or “chiplets.” These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex
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Reading, UK – 17 October 2023. Sondrel (AIM: SND), is pleased to announce that it is one of the founding members of Arm® Total Design, an ecosystem that is committed to bringing Arm Neoverse™ CSS-based designs to market. Arm Neoverse CSS features high-end Arm Neoverse cores that are designed for
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Flip chip , also known as “controlled-collapse chip connection” (C4), is an advanced semiconductor packaging technique that allows the direct attachment of a semiconductor chip, typically an integrated circuit (IC), to a substrate or circuit board. Unlike traditional packaging methods like wire bonding, in flip chip technology, the active side
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LAWRENCEVILLE, GA – October 16, 2023 — Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), has been recognized by TSMC as the recipient of the 2023 OIP Partner of the Year Award for Analog/Mixed Signal IP. The OIP Partner of the Year award honors TSMC Open Innovation
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In the world of computers, we’re used to thinking in terms of simple “on” and “off” signals, like flipping a light switch. But imagine if your computer could do much more than that—like being in two states at once! This is where quantum silicon chips come into play.
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Meyreuil, France – October 5, 2023 – Presto Engineering, a recognized expert in ASIC design and semiconductor engineering and production services, is pleased to announce its collaboration with Nokia for the industrialization of new equipment designed to build the foundations of the next generation of microwave links as part of
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