Author Archives: anysilicon

Name: anysilicon

Silicon Creations’ SerDes Technology Helps Power Leading-Edge 8K TV

Partnership

Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced today that its SerDes (Serializer/Deserializer) receive and transmit PMA (Physical Media Attachment) technology has been deployed in an SoC that powers a leading 8K (UHD) flat-panel television.
 
The SoC was designed by Socle, an IC ODM

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Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE

text labeled PRESS RELEASE

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today at 55th DAC 2018 announced the availability of Sankalp Automated Validation Environment (SAVE). Sankalp will be demonstrating a video demo of the solution at its booth #2457. SAVE allows post-silicon validation of Analog

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How to Cut Costs, Time and Pain during ASIC Manufacturing

Managing an end-to-end ASIC supply chain process is one of the biggest challenges of chip projects. The semiconductor value chain, which has always been complex, does not seem to get any simpler. A McKinsey report pointed out “there has been a 50 percent increase in test and verification time during

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Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications

News

Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions today at 55th DAC 2018 announced release of its Embedded DisplayPort (eDP) receiver IP. DisplayPort offers high bandwidth, lower pin count and low power solutions for high-resolution displays. The Chip on Glass (COG) technology enables area

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CEO Talk: Udi Shaked, Inomize

This interview was conducted with Udi Shaked, CEO of Inomize.
 
Full Name: Udi Shaked
Title: CEO
Company: Inomize

 
 
Tell me a bit about your background. How did you first get started with Inomize? 
 
We came up with the idea of launching Inomize back in 2007,

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eWLB Package Overview

wafer bumping feature

The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
 
The first eWLB package was used in mobile phones in 2009 and since

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