Author Archives: anysilicon

Name: anysilicon

Canaan-Creative employs Moortec’s Temperature Sensor in their new ASIC aimed at HPC IC

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Moortec, providers of In-Chip Monitoring PVT Subsystems solutions are pleased to announce that Canaan-Creative have employed Moortec’s In-Chip Monitoring Subsystem in their HPC IC.
 
Canaan-Creative is a worldwide leader in the design of high performance computing IC. “We have compared performance from other companies with Moortec’s and find that PVT

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Silvaco Completes Acquisition of NanGate

Silvaco today announced that it has acquired NanGate, a leader in Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.
 
NanGate’s Library Creation Platform has been deployed by a large number of semiconductor companies creating standard cell libraries

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Understanding TSMC’s VCA Program

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TSMC has recently updated its VCA (Value Channel Aggregator) program so we thought it would be beneficial to review TSMC VCA program and update our readers with the program benefits and value proposition.
 
As you all know — TSMC is a pure-play foundry and as such, it’s offering wafer

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CEO Talk: Scott Bulbrook

This interview was held with Scott Bulbrook,  Managing Partner, VP of Engineering at DA-Integrated.
 

 
Tell me a bit about your background? How did you first get started with DA-Integrated?
 
I have always had a passion for the semiconductor industry. At university Semiconductor Physics was my favorite course. I

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Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents

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Flex Logix™ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced today that three interconnect patents have been issued to Cheng Wang, co-founder of Flex Logix. These patents highlight the breakthrough interconnect technology that enables Flex Logix to design eFPGA in a new process node in ~six

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92 IC Wafer Fabs Closed or Repurposed From 2009-2017

Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology

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