Author Archives: anysilicon

Name: anysilicon

Google Will Design a Mobile Phone CPU

Google is taking the next necessary steps towards the mobile phone market and plans to start developing and producing CPU chips for enabling a complete mobile phone eco system, to be combined with its successful Android operating systems.
 

Google has started in recent weeks talks with several processors

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Low-Power SoC Design Integration Issues

As technology evolves, more functionality is being added on SOCs. At same time, pressure is building up to reduce operating and standby power. Today the market is focused on reducing power in wide spectrum of SOCs from CPUs, GPUs and Mobile not just IOT/wearable SOCs. Battery powered SOCs require

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Choosing the right VIP

In past few months, while interacting with customers, I came across a couple of cases where the VIP played a spoilsport. In one case, the IP & VIP were procured from the same vendor during the early phase of standard protocol evolution. One of the key USPs of the product was

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TSMC will enter the fan out wafer level package business

tsmc

“The fact that TSMC is interested in advanced packaging isn’t “new news”, comments Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). He adds: “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for

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BiCMOS process overview

While the entire semiconductor industry is excited about FinFET and FDSOI process technologies, there is one semiconductor technology that considered by engineers as “the process for real men” and it’s called BiCMOS.
 
BiCMOS process is essentially a combination of Bipolar transistor and CMOS transistors, it offers many technical advantages

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Sony spins off chipmaking business

Sony has announced that its semiconductor unit will now be separated from the company’s core business. The strategic decision arrived in order to allow the Japanese electronic firm to focus its resources and attentions on the Devices and the Digital image divisions. This last one in particular, in fact, has

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