[Sep 13, 2024] – Foxconn, a leading global electronics manufacturer, and HCL Technologies, a leading Indian technology services company, have taken a significant step towards establishing a semiconductor plant in Uttar Pradesh, India. The joint venture (JV) between the two companies has secured a 30-acre plot of land in Noida, near the upcoming Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area.
This development marks a key milestone in the JV’s plans to set up a semiconductor outsourced assembly and testing (OSAT) unit in India. The project, once approved by the central government, will be the first semiconductor facility in Uttar Pradesh.
The move comes amidst India’s ambitious push to develop a robust semiconductor manufacturing ecosystem. The government’s Production Linked Incentive (PLI) scheme has attracted significant interest from foreign investors, including Foxconn and HCL, who are looking to collaborate with Indian partners to establish semiconductor units in the country.
While the OSAT unit’s setup and location are pending central government approval, sources suggest that the approval process is a mere formality. The JV is expected to submit its proposal soon, with approval anticipated within a few weeks.
This latest development follows the recent approval of semiconductor projects by Micron Technology and Tata. Micron received approval for an assembly, testing, marking and packaging (ATMP) unit in Sanand, Gujarat, while a joint venture of Tata Electronics Private Limited (TEPL) and Powerchip Semiconductor Manufacturing Corp (PSMC) of Taiwan secured approval for a semiconductor fabrication unit. Additionally, Tata Semiconductor Assembly and Test Pvt Ltd (TSAT) is establishing an indigenous advanced semiconductor packaging unit in Assam.
The establishment of Foxconn and HCL’s semiconductor plant in Uttar Pradesh will further strengthen India’s position as a global hub for semiconductor manufacturing and contribute to the country’s economic growth and technological advancement.