Author Archives: anysilicon

Name: anysilicon

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

press release

Shanghai, China, March 28, 2024 — VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). This solution is applicable to mobile phones, Bluetooth earphones including True

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What does a VLSI Engineer do?

engineer with various tools

Like architects shaping skylines, VLSI engineers are the masterminds behind the intricate circuits that power modern electronics. In the world of microelectronics, they play a pivotal role, crafting the very foundation upon which today’s technology thrives.
 
Core Responsibilities in Chip Creation: VLSI engineers are tasked with developing and refining

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What is an ASIC Engineer?

engineer with various tools

Like a master tailor crafting a bespoke suit, an ASIC engineer designs circuits tailored for specific applications with precision and expertise.
 
 
Analogous to architects who shape skylines, ASIC design engineers sculpt the electronic landscape by creating custom integrated circuits – the foundation upon which today’s technology stands.
 
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ASIC Design Flow: From Specification to Silicon

man holding a chip

The ASIC design flow takes a chip from product specification through architecture, RTL and circuit design, verification, DFT, synthesis, physical design, signoff and tape-out, followed by wafer fabrication, packaging, wafer sort, final test and production ramp. Each stage has its own technical deliverables and acceptance criteria, and mistakes made early

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Understanding CoWoS Packaging Technology

CoWoS Package feature

In order to cater to the computing demands for high performance computing (HPC) and artificial intelligence (AI), a need for a scalable package was felt. Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I/O connections. It allows 2.5D and

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Presto Engineering to Showcase Turnkey ASIC Design-to-Production Solutions at Embedded World 2024

Meyreuil, France—March 19, 2024—Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, will exhibit its turnkey ASIC design and production services at Embedded World, taking place April 9-11, 2024, in Nuremberg, Germany. Presto CEO, Cedric Mayor, will present “Going ASIC – Myth or

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