Taiwanese semiconductor company TSMC has announced plans to build a new chip fabrication plant (fab) in Arizona, United States. The company is the world’s largest contract chipmaker and supplies chips to tech giants such as Apple, Huawei, and Qualcomm. The new fab will use TSMC’s 5nm technology, which is a
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Chiplets are small, modular chips that can be combined to form a complete system-on-chip (SoC). They are designed to be used in a chiplet-based architecture, in which multiple chiplets are connected together to create a single, complex integrated circuit. Chiplet-based architectures offer several benefits over traditional monolithic SoCs, including improved
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This interview was held with Boaz Shani, VP Sales at ATS Engineering.
Tell me a bit about your background?
I have over 20 years of experience in the Semiconductors industry, performing management roles in Engineering, Business Development, and Sales. Before working at ATS I was responsible
Pragmatic Semiconductor, a world leader in flexible electronics, is proud to announce that it has secured $35 million additional investment from high quality institutional investors. This brings the total raised in its Series C round to $125 million, oversubscribing the original target by more than 50%. Investors have been attracted
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Sofics bv (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that it joined the Intel Foundry Services (IFS) Accelerator IP Alliance program. With support from IFS, its TakeCharge® Electrostatic Discharge (ESD) portfolio will be validated on the most advanced processes. Currently, more than 100 fabless companies already use Sofics
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced it has collaborated with Infineon to develop a SONOS eFlash platform on UMC’s 40uLP process. This platform includes a newly developed eFlash subsystem IP and complete eFlash testing solution with easy-to-integrate and fast data access
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