One of the most common factors that can have a lasting impact on any given semiconductor device is heat. Any logic circuit or electronic device requires a power supply to drive the function of its parts. While most of this power is used up for basic logic functions and signal
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“Fan-out packaging continues to evolve, establishing a new market class, UHD Fan-Out,” asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “Being actively explored and validated as one of the high performing and multi-die packaging platforms, Fan-Out Packaging is breaking through into new applications in 5G and HPC. In the Fan-Out Packaging: Technologies
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WLP will definitely be a winner by 2025, declared Yole Développement (Yole) in its new Advanced Packaging Quarterly Market Monitor. $2.5B will be the market figure to remember as it will be Fan-out (FO) package revenue by 2025. Behind this data, there is TSMC’s strategy to drive fan-out for 5G applications. In parallel,
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“The demand for SiP[1] has increased significantly in recent years, with an adoption in a wide ranging of applications”, announces Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “SiP involves low-end including smaller package size & lower I/O count and high-end applications with larger package size & higher I/O. SiP is also leveraging
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“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).
Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts, the automotive
Lead Frame Overview
A lead frame is a generic term for a type of (mostly) low-cost IC package assembly used for DIL types packages as well as PLCCs and QFNs.
The frame is typically made of a thin layer of copper, though other materials, such as aluminum
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