Category Archives: ASIC Design

Marquee Semiconductor Engages Industry Veteran Gideon Intrater as Strategic Advisor

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MILPITAS, CALIFORNIA, UNITED STATES, January 31, 2024 — Marquee Semiconductor, a global leader in chip design solutions, announces it has brought on semiconductor industry veteran Gideon Intrater as a Strategic Advisor. Mr. Intrater brings to Marquee more than 30 years of experience gained through technical, marketing and sales leadership roles at

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Cadence Acquires Invecas to Accelerate System Realization

Acquistion

Transaction brings Cadence skilled system design expertise in delivering end-to-end custom solutions to customers across multiple industries
 
SAN JOSE, Calif.– January 08, 2024 — Cadence Design Systems, Inc. (Nasdaq: CDNS) announced today that it has acquired Invecas, Inc., a leading provider of design engineering, embedded software and system-level solutions, headquartered

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What does a Design For Test (DfT) Engineer do?

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Design for Testability (DFT) engineer is an indispensable cornerstone within the semiconductor industry, providing a vital framework that ensures the reliability, efficiency, and cost-effectiveness of integrated circuits. Its primary objective revolves around embedding testability features directly into the design phase of these intricate circuits, thereby facilitating streamlined testing procedures, early

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ELECTRA IC Marks a Decade of Design and Verification Excellence at CES 2024

Electraic

Istanbul, 18.Dec.2023 – Istanbul-based ELECTRA IC, a distinguished leader in design and verification solutions, proudly announces its milestone achievement of ten years in the industry. To commemorate this significant anniversary, ELECTRA IC will be showcasing its latest achievements at CES (Consumer Electronics Show) 2024 in Las Vegas, reaffirming its commitment

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What’s the job of a Physical Design Engineer?

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Physical design engineer is a specialized function within chip design that encompasses the intricate process of transforming the abstract hardware logic initially delineated in a high-level Hardware Description Language (HDL) into a tangible configuration of physical logic gates and interconnecting wires. This tangible representation serves as the blueprint for the

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Green Mountain Semiconductor Participates in Unveiling of Innovative AI processor

press release

BURLINGTON, VT–Green Mountain Semiconductor, a design house involved in AI-related circuit design initiatives since 2014 and specializing in Custom Analog, Digital, and Mixed Signal Design with a focus on Memory (DRAM, SRAM, and Emerging NVM), has achieved a groundbreaking milestone on behalf of their client by unveiling an innovative ASIC

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