Category Archives: ASIC Design

CEO Talk: Gord Harling, CMC Microsystems

This interview was held with Gord Harling, President with CMC Microsystems.
 

 
Tell me a bit about your background? How did you first get started with CMC Microsystems?
 
I spent 10 years in R&D with large telecom/semiconductor companies, 20 years of start-ups and now working in not-for-profits.
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MosChip Joins AnySilicon Program

AnySilicon, the leading marketplace for ASIC service providers, announced today that MosChip, a semiconductor and system design company with a focus on Turnkey ASICs, has joined AnySilicon to promote its ASIC development services. As part of the AnySilicon platform, MosChip will gain access to a full range of online marketing

SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications

MAISONS-LAFFITTE, France – February 23, 2021 SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced a multi-year joint collaboration to enable expansive development of innovative

The Ultimate Guide to Clock Gating

Clock Gating is defined as: “Clock gating is a technique/methodology to turn off the clock to certain parts of the digital design when not needed”.
 
The Need for Clock Gating
 
With most of the SoCs heavily constrained by power budgets, it is of utmost importance to reduce power

HDL Design House Partners with Marketing Platform AnySilicon

AnySilicon, the leading marketplace for ASIC service providers, announced today that HDL Design House, a leading-edge digital, analog, and back-end design and verification services provider, has joined AnySilicon to promote its design services. As part of the AnySilicon platform, HDL Design House will gain access to a full range of

Protocol and Interface Agnostic Universal D2D Controller for HPC and Chiplets

Demand for die-to-die and chip-to-chip interfaces has been growing steadily in the past few years due to new applications in cloud/data centers, AI (training and edge applications), and High-Performance Computing (HPC). The demand is driven by the requirements of high throughput, low latency and low power in these applications. Advances in packaging technology are further helping the