Category Archives: ASIC Industry Market Trends

Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance

SANTA CLARA, Calif. – August 13, 2024 – Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced a strategic investment from VentureTech Alliance.
 
The additional funding puts Eliyan’s total investment past the $100 million mark and will help further the company’s

Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5%

WASHINGTON—August 5, 2024—The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024. Sales in June 2024 were $50.0 billion, an

Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports

MILPITAS, Calif. — August 1, 2024 — Worldwide silicon wafer shipments increased 7.1% quarter-over-quarter to 3,035 million square inches (MSI) in the second quarter of 2024 but saw an 8.9% decline from the 3,331 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its

Faraday Reports Second Quarter 2024 Results

 Second Quarter 2024 Highlights [1]:

Revenue of NT$2,649 million (US$82.8 million)
Gross margin was 47.1%
Net income attributed to stockholders of the parent was NT$261 million (US$8.2 million)
Earnings per share of NT$1.00

【Hsinchu,  Taiwan】 Jul. 30, 2024
 
Faraday Technology Corporation (“Faraday” or the “Company”) (TWSE: 3035),

Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicle. This participation in the alliance underscores

High Bandwidth Memory (HBM): Ultimate Guide

HBM presents a significant leap over traditional memory types. Key features such as astonishing memory bandwidth, reduced power consumption, impressive memory capacity, and swift transfer rates distinguish HBM from its predecessors. Understanding these characteristics is essential for appreciating the impact of this cutting-edge technology.
 

 
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