Early on in Chip projects, yield is not taken very seriously. The common thinking goes – anyhow there isn’t much to do as this early point of time. However, there are actually several things you can do even before the Chip design starts, which will translate to clear savings.
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This post describes the growth of top 10 semiconductors companies in the last 10 years. It tracks the growth of the 10 semiconductor leaders from 2002 to 2011 and shares some nontraditional thoughts about the ten semiconductors vendors’ success:
Thought #1: Follow the market trends
Since the 80’s companies from USA,
Paul Otellini has made the best decision for himself and for Intel. He is leaving the company.
There are only a few who don’t admire Intel. Intel has introduced ground breaking technologies decade after decade and has been demonstrating top financial results year after year. Is it beneficial for Intel
Silicon wafers are the most essential element in the realization of ICs. The semiconductor industry had invested heavily to increase the wafer size during the last 30 years, so while foundries used to produce 1 inch wafers, today’s common wafer size is 300mm (11.8 times larger than 1 inch). There
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Pure-play foundries are offering vanilla flavor services, meaning one can buy only wafers. ASIC design, testing, packaging and supply chain services are not part of their service offering.
Large IDM players, who manage their own supply chain, seek this type of engagement because they prefer to own the supply
Tapeout is a major milestone in every ASIC project lifecycle. It means the design phase is completed and you are ready to send out the GDSII to the fab for production.
The term “tapeout” was coined in 70’s. Historically, engineered used a magnetic tape to store all the ASIC design