Semiconductor Latest News

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Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification

press release

SAN JOSE, CALIF. –– February 20, 2025 –– Breker Verification Systems today confirmed its RISC-V SystemVIP library components and test suite synthesis product portfolio is deployed in more than 15 commercial RISC-V semiconductor design projects, while its RISC-V products are used in several large-scale academic projects.
 
Large, complex application

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Faraday Reports Full Year 2024 Results

market

Fourth Quarter 2024 Highlights [1]:

Revenue of NT$2,953 million (US$91.5 million)
Gross margin was 42.8%
Net income attributed to stockholders of the parent was NT$236 million (US$7.3 million)
Earnings per share of NT$0.91

【Hsinchu,  Taiwan】 Feb. 21, 2025
 
Faraday Technology Corporation (“Faraday” or the “Company”) (TWSE: 3035),

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SignOff Semiconductors Unveils Expansion Plans with Its New Office in Penang, Malaysia

PENANG, Malaysia , Dec. 19, 2024  — SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a leading provider of VLSI and Embedded Design services, is thrilled to announce the opening of its new office in Penang, Malaysia. This expansion enables the company to meet the growing demand for semiconductor chip design services from Fortune 500 companies operating in and expanding within Penang. It also aligns perfectly with the Malaysian government’s vision

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YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI

news

SAN RAMON, CA, UNITED STATES, February 19, 2025 — YorChip, Inc. in collaboration with its design partner SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core. The IP is optimized for size, power and latency and targets edge AI applications as well as Data Center Accelerator

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Arteris Revolutionizes Semiconductor Design with FlexGen – Smart Network-on-Chip IP

press release

CAMPBELL, Calif., February 18, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP. FlexGen from Arteris dramatically accelerates chip development while optimizing performance efficiency, addressing the rising demand for faster, more sustainable innovation

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ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

BAYAN LEPAS, Malaysia, February 18, 2025–ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan Lepas Free Industrial Zone. The new plant is part of a strategic expansion plan that will expand the floor space of

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Top Semiconductor Foundries 2024 Revenue

The accompanying table provides a summary of the full-year 2024 performance, including revenue (in USD billions), year-over-year (YoY) growth, and relevant notes for each company. Below are some highlights from the individual company reports:
 
TSMC: The world’s leading foundry, TSMC, continued its strong performance, reporting exceptional growth. While specific

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OpenAI to Finalize First 3nm AI Chip Design, Aiming for Independence from NVIDIA

OpenAI, the maker of ChatGPT, is set to finalize its first in-house AI chip design in the coming months, taking a key step toward reducing its reliance on NVIDIA. According to Reuters, the company is expected to send the chips to TSMC for fabrication soon as it aims for mass

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Thalia Announces Latest Version of AMALIA with Game-Changing ‘Device-Stretching’ Algorithm and Flip Well Intelligence

press release

Cwmbran, United Kingdom– 11/02/2025 – Thalia Design Automation is thrilled to announce the immediate availability of the latest version of the AMALIA Suite, their AI-powered industry end-to-end IP reuse platform. 
 
This release brings significant enhancements throughout AMALIA, particularly within its Layout Automation Suite.  The solution retains the intrinsic value

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Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design

ATLANTA, GA, February 10, 2025 – Silicon Creations, a leading provider of high-performance analog and mixed-signal intellectual property (IP), today announced the successful tape-out of a chip on the TSMC N2P process including a novel temperature sensor design and an expanded portfolio of clocking IP to support next-generation semiconductor products.
 
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