Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
HardwareBee, an independent hardware blog, launched today an online marketplace linking electronic design service providers and companies in search of development services. Covering electronic design services, FPGA design services, embedded software companies, PCB layout services, PCB assembly & manufacturing services, and turnkey service providers. The HardwareBee site allows companies to
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Advantest has announced a new programming environment, known as SmarTest 8, for the popular V93000 tester. As more and more users switch to SmarTest 8, it becomes important to have a vector translation tool capable of converting between popular vector formats and SmarTest 8.
Source III is proud to
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that multiple factories have passed certification audits for IATF-16949:2016, a key certification required for manufacturers who supply products to the automotive market. IATF-16949:2016 replaces and supersedes the older ISO/TS-16949 standard.
For ASIC or IC, there are recommended environmental conditions for their storage which allows them to perform at proper functionally. However, it is well known that storage may not always be close to the recommended standard. This is where the high temperature storage life testing (HTSL reliability testing) comes into
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The Highly Accelerated Stress Test (HAST testing) involves the effects of humidity and temperature on an IC or ASIC. The HAST test is designed to test the package of the ASIC under extreme humidity and temperature conditions. Devices that pass such HAST tests will be able to withstand the normal
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In addition to the human body model (HBM) which is used to measure the electro-static discharge (ESD) that may affect IC/ASIC devices, there is also damage that may come from charged device model (CDM) which also must be tested. Although superficially similar to the HBM, the CDM is different and
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In building integrated circuits (ICs) or ASICs, one area of concern is how they are protected from outside electrical sources. While most systems are geared towards power overloads, one source that may cause considerable damage is the electro-static discharge (ESD) that comes from the human body. To help test for
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today unveiled the success of projector ASICs, covering high-end 4K/8K projector, head-up display (HUD), AR, and 3D sensing pico-projector applications for top-tier projector manufacturers in Japan, USA, and Taiwan. By leveraging its design methodology and IP customization
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Research included in the April Update to the 2018 edition of IC Insights’ McClean Report shows that the world’s leading semiconductor suppliers significantly increased their marketshare over the past decade. The top-5 semiconductor suppliers accounted for 43% of the world’s semiconductor sales in 2017, an increase of 10 percentage points from 10 years earlier
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In one of the previous posts we discussed a cool technique to reduce leakage current. This time we will look at dynamic power consumption due to switching and some common techniques to reduce it.
Usually, with just a little bit of thinking, reduction of switching activity is quite possible. Let’s look