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Amkor Offers Optical Package Solutions for Multiple Applications

December 13, 2018, anysilicon

Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including LIDAR, fingerprint sensing, ambient light sensing and 3D facial recognition.

 

 

“Amkor has over 25 years of experience manufacturing and testing MEMS and Sensor devices for automotive, communications and consumer applications” said John Donaghey, Corporate Vice President, Amkor Technology. “We are excited to extend our high-volume MEMS and Sensor package platforms to address optical market requirements. This allows our customers to bring their solutions to market quickly without sacrificing performance.”

 

 

Amkor’s factories are IATF16949 certified and have the ability to meet the rigorous requirements of the AEC-Q100 specification.  Full turnkey Optical MEMS and Sensor solutions from Amkor include design, assembly and test.

 

 

To learn more about Amkor’s capabilities in Optical MEMS and Sensor packaging, visit Amkor.com/technology/optical-sensors/

 

 

This announcement is also available in ChineseJapanese, and Korean.

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