Semiconductor Latest News

Understanding ESD CDM in IC Design

In addition to the human body model (HBM) which is used to measure the electro-static discharge (ESD) that may affect IC/ASIC devices, there is also damage that may come from charged device model (CDM) which also must be tested. Although superficially similar to the HBM, the CDM is different and

Understanding ESD HBM in IC Design

In building integrated circuits (ICs) or ASICs, one area of concern is how they are protected from outside electrical sources. While most systems are geared towards power overloads, one source that may cause considerable damage is the electro-static discharge (ESD) that comes from the human body. To help test for

Faraday Leads ASIC Industry with Supporting Major Projector Technologies

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today unveiled the success of projector ASICs, covering high-end 4K/8K projector, head-up display (HUD), AR, and 3D sensing pico-projector applications for top-tier projector manufacturers in Japan, USA, and Taiwan. By leveraging its design methodology and IP customization

Semiconductor Leaders’ Marketshares Surge Over the Past 10 Years

Research included in the April Update to the 2018 edition of IC Insights’ McClean Report shows that the world’s leading semiconductor suppliers significantly increased their marketshare over the past decade. The top-5 semiconductor suppliers accounted for 43% of the world’s semiconductor sales in 2017, an increase of 10 percentage points from 10 years earlier

ASIC Design Low Power Techniques – Reducing Switching

In one of the previous posts we discussed a cool technique to reduce leakage current. This time we will look at dynamic power consumption due to switching and some common techniques to reduce it.
 
Usually, with just a little bit of thinking, reduction of switching activity is quite possible. Let’s look

Understanding Bluetooth Mesh – the Next Wave of IoT Technology

The market for Bluetooth low energy devices is expected to reach 1.4 Billion, growing at a CAGR of 34% between 2015 to 2021, as per ABI Research. While investments in Internet-of-Things (IoT) technology are ever increasing, there are many wireless technologies such as Zigbee, Wi-Fi, Bluetooth and Z-wave competing for

Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memory

Dolphin Integration, leader in innovative design solutions for the next generation of Energy-Efficient System-on-Chips, augments TSMC’s IP ecosystem at 40 nm with TITAN, a breakthrough architecture for Read Only Memory compiler. This cost effective, single-layer and late programmable ROM compiler is capable of generating instance sizes from 512 bits to

Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales

Codasip, the leading supplier of RISC-V® embedded processor intellectual property, today announced that Jerry Ardizzone has joined as Vice President of Worldwide Sales, reporting to CEO Karel Masařík.
 
“We are very excited to have Jerry on board to lead our global sales efforts,” declared Karel Masařík, CEO and founder

CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators

Semiconductor intellectual property provider CAST, Inc. has taken advantage of a new cloud-based FPGA accelerator marketplace developed by Accelize®to make industry-leading GZIP data compression available to users and developers whenever they need it.
 
The new AccelStore™makes critical functions like GZIP directly available to end users on a rental by

CEO Talk: Stefano Perticaroli, RAME

This interview was help with Stefano Perticaroli, Ph.D. Eng., CEO at Radio Analog Micro Electronics srl.
 

 
Tell me a bit about your background? How did you first get started with Radio Analog Micro Electronics?
 
I completed my Ph.D in Electronics Engineering at DIET Sapienza Università di Roma