Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Siemens has entered into an agreement to acquire Saskatoon, Canada-based Solido Design Automation Inc., a leading provider of variation-aware design and characterization software to semiconductor companies worldwide. Solido’s machine learning-based products are currently used in production at over 40 major companies, enabling them to design, verify, and manufacture more competitive
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Since its invention in the `60s, integrated circuit development has seen an aggressive and cyclic pace for improvement pushed by specific disruptive applications. These once were military/aerospace, mainframe computer, minicomputer, personal computers, networking, mobile and more recently smartphones. The traditional approach has always been to make the most out of
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Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has acquired nusemi inc, a company focused on the development of ultra-high-speed Serializer/Deserializer (SerDes) communications IP.
SerDes solutions enable high-speed communications between chips, backplane and long-haul optical interconnect by converting between parallel data and extremely high-speed serial data streams with
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today received an award from Software Technology Parks of India (STPI) for being the Highest Exporter – ITES in the Hubballi Region award. Sankalp Semiconductor has consecutively third time won the award. According to
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UltraSoC today announced that Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, has licensed UltraSoC’s universal analytics and embedded intelligence platform for use in an expanding range of Microsemi products based on the RISC-V open source processor architecture.
This latest engagement for UltraSoC extends
Open-Silicon today announced the availability of a comprehensive IP subsystem targeted at high-bandwidth networking applications. The subsystem expands on Open-Silicon’s existing high speed chip-to-chip Interlaken interface IP to include Ethernet Physical Coding Sublayer (PCS), Flex Ethernet (FlexE) and multi-channel multi-rate Forward Error Correction (FEC) IPs targeted for Ethernet endpoint and
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IC Insights has revised its outlook for semiconductor industry capital spending and will present its new findings in the November Update to The McClean Report 2017, which will be released at the end of this month. IC Insights’ latest forecast now shows semiconductor industry capital spending climbing 35% this year to $90.8 billion.
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DA-Integrated, a full-service IC Design, Supply and Test services provider in Ottawa, Canada and Chroma, a Tier 1 Taiwanese Test Equipment manufacturer announce today that DA-Integrated has selected and installed the Chroma 3650 series ATE system. The Chroma 3650’s highly flexible configuration, and best in class production test rates make
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Sometimes called IP core or IP block, semiconductor intellectual property core is an integrated circuit or block, cell, or logic that is reusable that provides a design which is the intellectual property of its creator or party. The term itself comes from the source code copyright or licensing of the
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OmniPHY, Inc. OmniPHY Semiconductor, Inc. today announced it will be showcasing how it leverages automotive Ethernet technology to create robust automotive semiconductor IP solutions at the IEEE-SA Automotive Ethernet Technology Day forum. The event is being held on October 31 – November 2, 2017, at the San Jose McEnery Convention
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