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Mont-Saint-Guibert, Belgium, January 28, 2025 – intoPIX, a leading provider of innovative image compression technologies, and PlexusAV, a pioneer in IPMX solutions, are proud to announce the successful interoperability testing between the Plexus P-AVN-4 IPMX JPEG XS FIP transceiver and the new intoPIX Titanium Software Suite. This collaboration highlights the
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SUNNYVALE, Calif., Jan. 21, 2025 /PRNewswire/ — Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while
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SAN JOSE, Calif.— January 21, 2025 — Cadence (Nasdaq: CDNS) today announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider. The addition of Secure-IC’s talent and highly complementary, proven portfolio of embedded security IP, security solutions, security evaluation tools and services will
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Multi Chip Modules (MCM) have emerged as a game-changing solution. As consumer demand for faster, more powerful electronics increases, traditional chip designs can no longer meet the growing need for performance and space-saving designs. MCMs offer a sophisticated approach to semiconductor architecture by integrating multiple chips into a single package.
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Heterogeneous integration offers a solution by allowing different materials and components to work together seamlessly, driving innovation in various applications. This approach not only enhances system performance but also enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.
Understanding heterogeneous integration requires a grasp
MELVILLE, N.Y., Jan. 15, 2025 /PRNewswire/ — Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies (“Integra”). Integra is an Outsourced Semiconductor
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SCOTTSDALE, Ariz. – Dec. 9, 2024 – onsemi (Nasdaq: ON) today announced that it has entered into an agreement to acquire the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash. The acquisition will complement onsemi’s extensive EliteSiC
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Chip Scale Packaging (CSP) emerges as a groundbreaking solution that optimizes space while enhancing performance in the realm of microelectronics. This innovative packaging method is transforming how devices are designed and manufactured, impacting various industries.
Chip Scale Packaging is characterized by its compact size, which allows for
The semiconductor industry stands at the forefront of innovation and change. From the smartphones in our pockets to the autonomous vehicles of the future, semiconductors are the critical building blocks that drive progress across various sectors. Understanding the trends shaping this industry is essential for grasping the future of technology.
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Woodcliff Lake, New Jersey — January 16, 2025—CAST, a leading semiconductor intellectual property (IP) core provider, is excited to announce the upcoming release of its new KiviPQC™-KEM IP core and invites early adopters to engage in product evaluations. This new IP core implements the Module-Lattice Key Encapsulation Mechanism (ML-KEM) as
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